CARRIER FOR A SUBSTRATE AND METHOD FOR CARRYING A SUBSTRATE

A carrier configured for holding and transporting a substrate in a transport direction in a vacuum processing system and a method for carrying a substrate in a transport direction during a deposition process in a deposition chamber with a carrier is described. The carrier includes two side edges opp...

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Bibliographische Detailangaben
1. Verfasser:	LINDENBERG, Ralph
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A carrier configured for holding and transporting a substrate in a transport direction in a vacuum processing system and a method for carrying a substrate in a transport direction during a deposition process in a deposition chamber with a carrier is described. The carrier includes two side edges opposing each other, a joining structure arranged between the side edges, having a flat structure comprising a plurality of apertures, each exposing the same substrate and an aperture ratio of at least 0.5, and a holding assembly configured for holding the substrate adjacent to the joining structure. L'invention concerne un support conçu pour maintenir et transporter un substrat dans une direction de transport dans un système de traitement sous vide et un procédé permettant de supporter au moyen d'un support un substrat dans une direction de transport pendant un processus de dépôt dans une chambre de dépôt. Le support comprend deux bords latéraux en regard et une structure de jonction agencée entre les bords latéraux. La structure de jonction comprend : une structure plate comportant une pluralité d'ouvertures, chaque ouverture exposant ledit substrat et présentant un rapport d'ouverture d'au moins 0,5 ; et un ensemble de maintien conçu pour maintenir le substrat adjacent à la structure de jonction.