APPARATUS FOR HANDLING VARIOUS SIZED SUBSTRATES
Embodiments of methods and apparatus for handling substrates of different sizes are provided herein. In some embodiments, an apparatus for handling substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate having a first size...
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| creator | PARATHITHASAN, Karrthik LIM, Fang Jie PEH, Eng Sheng THIRUNAVUKARASU, Sriskantharajah |
| description | Embodiments of methods and apparatus for handling substrates of different sizes are provided herein. In some embodiments, an apparatus for handling substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate having a first size and a second set of contact pads configured to support a substrate having a second size, smaller than the first size.
La présente invention concerne des modes de réalisation de procédés et un appareil de manipulation de substrats de tailles différentes . Dans certains modes de réalisation, un appareil de manipulation de substrats de tailles différentes comprend : une paire d'effecteurs terminaux ayant un premier ensemble de plots de contact conçus pour supporter un substrat ayant une première taille et un second ensemble de plots de contact conçus pour supporter un substrat ayant une seconde taille, inférieure à la première taille. |
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La présente invention concerne des modes de réalisation de procédés et un appareil de manipulation de substrats de tailles différentes . Dans certains modes de réalisation, un appareil de manipulation de substrats de tailles différentes comprend : une paire d'effecteurs terminaux ayant un premier ensemble de plots de contact conçus pour supporter un substrat ayant une première taille et un second ensemble de plots de contact conçus pour supporter un substrat ayant une seconde taille, inférieure à la première taille.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190822&DB=EPODOC&CC=WO&NR=2019161026A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190822&DB=EPODOC&CC=WO&NR=2019161026A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARATHITHASAN, Karrthik</creatorcontrib><creatorcontrib>LIM, Fang Jie</creatorcontrib><creatorcontrib>PEH, Eng Sheng</creatorcontrib><creatorcontrib>THIRUNAVUKARASU, Sriskantharajah</creatorcontrib><title>APPARATUS FOR HANDLING VARIOUS SIZED SUBSTRATES</title><description>Embodiments of methods and apparatus for handling substrates of different sizes are provided herein. In some embodiments, an apparatus for handling substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate having a first size and a second set of contact pads configured to support a substrate having a second size, smaller than the first size.
La présente invention concerne des modes de réalisation de procédés et un appareil de manipulation de substrats de tailles différentes . Dans certains modes de réalisation, un appareil de manipulation de substrats de tailles différentes comprend : une paire d'effecteurs terminaux ayant un premier ensemble de plots de contact conçus pour supporter un substrat ayant une première taille et un second ensemble de plots de contact conçus pour supporter un substrat ayant une seconde taille, inférieure à la première taille.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB3DAhwDHIMCQ1WcPMPUvBw9HPx8fRzVwhzDPL0BwoGe0a5uigEhzoFhwBVuQbzMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL4cH8jA0NLQzNDAyMzR0Nj4lQBAL72JzM</recordid><startdate>20190822</startdate><enddate>20190822</enddate><creator>PARATHITHASAN, Karrthik</creator><creator>LIM, Fang Jie</creator><creator>PEH, Eng Sheng</creator><creator>THIRUNAVUKARASU, Sriskantharajah</creator><scope>EVB</scope></search><sort><creationdate>20190822</creationdate><title>APPARATUS FOR HANDLING VARIOUS SIZED SUBSTRATES</title><author>PARATHITHASAN, Karrthik ; LIM, Fang Jie ; PEH, Eng Sheng ; THIRUNAVUKARASU, Sriskantharajah</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2019161026A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PARATHITHASAN, Karrthik</creatorcontrib><creatorcontrib>LIM, Fang Jie</creatorcontrib><creatorcontrib>PEH, Eng Sheng</creatorcontrib><creatorcontrib>THIRUNAVUKARASU, Sriskantharajah</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARATHITHASAN, Karrthik</au><au>LIM, Fang Jie</au><au>PEH, Eng Sheng</au><au>THIRUNAVUKARASU, Sriskantharajah</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR HANDLING VARIOUS SIZED SUBSTRATES</title><date>2019-08-22</date><risdate>2019</risdate><abstract>Embodiments of methods and apparatus for handling substrates of different sizes are provided herein. In some embodiments, an apparatus for handling substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate having a first size and a second set of contact pads configured to support a substrate having a second size, smaller than the first size.
La présente invention concerne des modes de réalisation de procédés et un appareil de manipulation de substrats de tailles différentes . Dans certains modes de réalisation, un appareil de manipulation de substrats de tailles différentes comprend : une paire d'effecteurs terminaux ayant un premier ensemble de plots de contact conçus pour supporter un substrat ayant une première taille et un second ensemble de plots de contact conçus pour supporter un substrat ayant une seconde taille, inférieure à la première taille.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | APPARATUS FOR HANDLING VARIOUS SIZED SUBSTRATES |
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