CIRCUIT SHEET MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, CIRCUIT SHEET, AND CIRCUIT BOARD
This circuit sheet manufacturing method includes: a step for preparing circuits arranged on a temporary fixation member; a step for filling a resin between the circuits; and a step for removing the temporary fixation member from the circuits after carrying out the step for filling the resin between...
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| creator | MURASUGI, Narutoshi NISHIYAMA, Tomoo TOGAWA, Mitsuo ARATA, Michitoshi |
| description | This circuit sheet manufacturing method includes: a step for preparing circuits arranged on a temporary fixation member; a step for filling a resin between the circuits; and a step for removing the temporary fixation member from the circuits after carrying out the step for filling the resin between the circuits.
L'invention concerne un procédé de fabrication de feuille de circuit comprenant : une étape consistant à préparer des circuits disposés sur un élément de fixation temporaire ; une étape consistant à effectuer un remplissage d'une résine entre les circuits ; et une étape consistant à retirer l'élément de fixation temporaire des circuits après l'exécution de l'étape de remplissage de la résine entre les circuits.
回路シートの製造方法は、仮固定材上に配置された回路を準備する工程と、前記回路の間に樹脂を充填する工程と、前記回路の間に樹脂を充填する工程の後に、前記回路から前記仮固定材を除去する工程と、含む。 |
| format | Patent |
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L'invention concerne un procédé de fabrication de feuille de circuit comprenant : une étape consistant à préparer des circuits disposés sur un élément de fixation temporaire ; une étape consistant à effectuer un remplissage d'une résine entre les circuits ; et une étape consistant à retirer l'élément de fixation temporaire des circuits après l'exécution de l'étape de remplissage de la résine entre les circuits.
回路シートの製造方法は、仮固定材上に配置された回路を準備する工程と、前記回路の間に樹脂を充填する工程と、前記回路の間に樹脂を充填する工程の後に、前記回路から前記仮固定材を除去する工程と、含む。</description><language>eng ; fre ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190725&DB=EPODOC&CC=WO&NR=2019142282A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190725&DB=EPODOC&CC=WO&NR=2019142282A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MURASUGI, Narutoshi</creatorcontrib><creatorcontrib>NISHIYAMA, Tomoo</creatorcontrib><creatorcontrib>TOGAWA, Mitsuo</creatorcontrib><creatorcontrib>ARATA, Michitoshi</creatorcontrib><title>CIRCUIT SHEET MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, CIRCUIT SHEET, AND CIRCUIT BOARD</title><description>This circuit sheet manufacturing method includes: a step for preparing circuits arranged on a temporary fixation member; a step for filling a resin between the circuits; and a step for removing the temporary fixation member from the circuits after carrying out the step for filling the resin between the circuits.
L'invention concerne un procédé de fabrication de feuille de circuit comprenant : une étape consistant à préparer des circuits disposés sur un élément de fixation temporaire ; une étape consistant à effectuer un remplissage d'une résine entre les circuits ; et une étape consistant à retirer l'élément de fixation temporaire des circuits après l'exécution de l'étape de remplissage de la résine entre les circuits.
回路シートの製造方法は、仮固定材上に配置された回路を準備する工程と、前記回路の間に樹脂を充填する工程と、前記回路の間に樹脂を充填する工程の後に、前記回路から前記仮固定材を除去する工程と、含む。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMhw9gxyDvUMUQj2cHUNUfB19At1c3QOCQ3y9HNX8HUN8fB30VGAqXHydwxyIaAGbI6OgqOfC6o2HgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSH-5vZGBoaWhiZGRh5GhoTJwqAOXENkw</recordid><startdate>20190725</startdate><enddate>20190725</enddate><creator>MURASUGI, Narutoshi</creator><creator>NISHIYAMA, Tomoo</creator><creator>TOGAWA, Mitsuo</creator><creator>ARATA, Michitoshi</creator><scope>EVB</scope></search><sort><creationdate>20190725</creationdate><title>CIRCUIT SHEET MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, CIRCUIT SHEET, AND CIRCUIT BOARD</title><author>MURASUGI, Narutoshi ; NISHIYAMA, Tomoo ; TOGAWA, Mitsuo ; ARATA, Michitoshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2019142282A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MURASUGI, Narutoshi</creatorcontrib><creatorcontrib>NISHIYAMA, Tomoo</creatorcontrib><creatorcontrib>TOGAWA, Mitsuo</creatorcontrib><creatorcontrib>ARATA, Michitoshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MURASUGI, Narutoshi</au><au>NISHIYAMA, Tomoo</au><au>TOGAWA, Mitsuo</au><au>ARATA, Michitoshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT SHEET MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, CIRCUIT SHEET, AND CIRCUIT BOARD</title><date>2019-07-25</date><risdate>2019</risdate><abstract>This circuit sheet manufacturing method includes: a step for preparing circuits arranged on a temporary fixation member; a step for filling a resin between the circuits; and a step for removing the temporary fixation member from the circuits after carrying out the step for filling the resin between the circuits.
L'invention concerne un procédé de fabrication de feuille de circuit comprenant : une étape consistant à préparer des circuits disposés sur un élément de fixation temporaire ; une étape consistant à effectuer un remplissage d'une résine entre les circuits ; et une étape consistant à retirer l'élément de fixation temporaire des circuits après l'exécution de l'étape de remplissage de la résine entre les circuits.
回路シートの製造方法は、仮固定材上に配置された回路を準備する工程と、前記回路の間に樹脂を充填する工程と、前記回路の間に樹脂を充填する工程の後に、前記回路から前記仮固定材を除去する工程と、含む。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | CIRCUIT SHEET MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, CIRCUIT SHEET, AND CIRCUIT BOARD |
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