DIODE COMPOSITE DEVICE AND MANUFACTURING METHOD THEREFOR
Provided are a diode composite device and a manufacturing method therefor. A diode composite device, according to an embodiment of the present invention, comprises: a first package including a filtering unit for filtering a high-speed signal; a second package stacked on the first package in a flip c...
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| creator | LEE, Jae Wook GU, Yu Gyeong |
| description | Provided are a diode composite device and a manufacturing method therefor. A diode composite device, according to an embodiment of the present invention, comprises: a first package including a filtering unit for filtering a high-speed signal; a second package stacked on the first package in a flip chip manner, and including a transient voltage suppressor (TVS) diode array having a protection function against electrical overload and static electricity; and a molding unit for molding the second package.
L'invention concerne un dispositif composite de diode et son procédé de fabrication. Un dispositif composite de diode, selon un mode de réalisation de la présente invention, inclut : une première enveloppe incluant une unité de filtre destinée à filtrer un signal à grande vitesse ; une deuxième enveloppe empilée sur la première enveloppe à la manière d'une puce retournée, et incluant une barrette de diodes de suppresseur de tension transitoire (TVS) ayant une fonction de protection contre les surcharges électriques et l'électricité statique ; et une unité de moulage destinée à mouler la deuxième enveloppe.
다이오드 복합소자 및 그의 제조 방법이 제공된다. 본 발명의 실시예에 따른다이오드 복합소자는 고속신호를 필터링하는 필터부를 포함하는 제1패키지, 제1패키지 상에 플립칩 방식으로 적층되며, 전기적 과부하 및 정전기에 대한 보호기능을 갖는 TVS(Transient Voltage Suppressor) 다이오드 어레이를 포함하는 제2패키지, 및 제2패키지를 몰딩하는 몰딩부를 포함한다. |
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L'invention concerne un dispositif composite de diode et son procédé de fabrication. Un dispositif composite de diode, selon un mode de réalisation de la présente invention, inclut : une première enveloppe incluant une unité de filtre destinée à filtrer un signal à grande vitesse ; une deuxième enveloppe empilée sur la première enveloppe à la manière d'une puce retournée, et incluant une barrette de diodes de suppresseur de tension transitoire (TVS) ayant une fonction de protection contre les surcharges électriques et l'électricité statique ; et une unité de moulage destinée à mouler la deuxième enveloppe.
다이오드 복합소자 및 그의 제조 방법이 제공된다. 본 발명의 실시예에 따른다이오드 복합소자는 고속신호를 필터링하는 필터부를 포함하는 제1패키지, 제1패키지 상에 플립칩 방식으로 적층되며, 전기적 과부하 및 정전기에 대한 보호기능을 갖는 TVS(Transient Voltage Suppressor) 다이오드 어레이를 포함하는 제2패키지, 및 제2패키지를 몰딩하는 몰딩부를 포함한다.</description><language>eng ; fre ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190613&DB=EPODOC&CC=WO&NR=2019112329A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190613&DB=EPODOC&CC=WO&NR=2019112329A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, Jae Wook</creatorcontrib><creatorcontrib>GU, Yu Gyeong</creatorcontrib><title>DIODE COMPOSITE DEVICE AND MANUFACTURING METHOD THEREFOR</title><description>Provided are a diode composite device and a manufacturing method therefor. A diode composite device, according to an embodiment of the present invention, comprises: a first package including a filtering unit for filtering a high-speed signal; a second package stacked on the first package in a flip chip manner, and including a transient voltage suppressor (TVS) diode array having a protection function against electrical overload and static electricity; and a molding unit for molding the second package.
L'invention concerne un dispositif composite de diode et son procédé de fabrication. Un dispositif composite de diode, selon un mode de réalisation de la présente invention, inclut : une première enveloppe incluant une unité de filtre destinée à filtrer un signal à grande vitesse ; une deuxième enveloppe empilée sur la première enveloppe à la manière d'une puce retournée, et incluant une barrette de diodes de suppresseur de tension transitoire (TVS) ayant une fonction de protection contre les surcharges électriques et l'électricité statique ; et une unité de moulage destinée à mouler la deuxième enveloppe.
다이오드 복합소자 및 그의 제조 방법이 제공된다. 본 발명의 실시예에 따른다이오드 복합소자는 고속신호를 필터링하는 필터부를 포함하는 제1패키지, 제1패키지 상에 플립칩 방식으로 적층되며, 전기적 과부하 및 정전기에 대한 보호기능을 갖는 TVS(Transient Voltage Suppressor) 다이오드 어레이를 포함하는 제2패키지, 및 제2패키지를 몰딩하는 몰딩부를 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBw8fR3cVVw9vcN8A_2DHFVcHEN83R2VXD0c1HwdfQLdXN0DgkN8vRzV_B1DfHwd1EI8XANcnXzD-JhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGhpaGhkbGRpaOhsbEqQIA_ncpWg</recordid><startdate>20190613</startdate><enddate>20190613</enddate><creator>LEE, Jae Wook</creator><creator>GU, Yu Gyeong</creator><scope>EVB</scope></search><sort><creationdate>20190613</creationdate><title>DIODE COMPOSITE DEVICE AND MANUFACTURING METHOD THEREFOR</title><author>LEE, Jae Wook ; GU, Yu Gyeong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2019112329A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Jae Wook</creatorcontrib><creatorcontrib>GU, Yu Gyeong</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Jae Wook</au><au>GU, Yu Gyeong</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIODE COMPOSITE DEVICE AND MANUFACTURING METHOD THEREFOR</title><date>2019-06-13</date><risdate>2019</risdate><abstract>Provided are a diode composite device and a manufacturing method therefor. A diode composite device, according to an embodiment of the present invention, comprises: a first package including a filtering unit for filtering a high-speed signal; a second package stacked on the first package in a flip chip manner, and including a transient voltage suppressor (TVS) diode array having a protection function against electrical overload and static electricity; and a molding unit for molding the second package.
L'invention concerne un dispositif composite de diode et son procédé de fabrication. Un dispositif composite de diode, selon un mode de réalisation de la présente invention, inclut : une première enveloppe incluant une unité de filtre destinée à filtrer un signal à grande vitesse ; une deuxième enveloppe empilée sur la première enveloppe à la manière d'une puce retournée, et incluant une barrette de diodes de suppresseur de tension transitoire (TVS) ayant une fonction de protection contre les surcharges électriques et l'électricité statique ; et une unité de moulage destinée à mouler la deuxième enveloppe.
다이오드 복합소자 및 그의 제조 방법이 제공된다. 본 발명의 실시예에 따른다이오드 복합소자는 고속신호를 필터링하는 필터부를 포함하는 제1패키지, 제1패키지 상에 플립칩 방식으로 적층되며, 전기적 과부하 및 정전기에 대한 보호기능을 갖는 TVS(Transient Voltage Suppressor) 다이오드 어레이를 포함하는 제2패키지, 및 제2패키지를 몰딩하는 몰딩부를 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| title | DIODE COMPOSITE DEVICE AND MANUFACTURING METHOD THEREFOR |
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