SUBSTRATE PROCESS ARRANGEMENT AND METHOD FOR HOLDING A SUBSTRATE
A substrate support (100) for supporting a substrate (101) having a front surface (102) to be processed and an opposing back surface (115) is described. The substrate support includes a support body and a dry adhesive assembly (240) attached to the support body, the dry adhesive assembly having one...
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| creator | HELLMICH, Anke HINTERSCHUSTER, Reiner LAU, Simon |
| description | A substrate support (100) for supporting a substrate (101) having a front surface (102) to be processed and an opposing back surface (115) is described. The substrate support includes a support body and a dry adhesive assembly (240) attached to the support body, the dry adhesive assembly having one or more dry adhesive elements (121), wherein the one or more dry adhesive elements support the substrate at the back surface in at least a center region and an outer region.
L'invention concerne un support de substrat (100) pour supporter un substrat (101) ayant une surface avant (102) à traiter et une surface arrière (115) opposée. Le support de substrat comprend un corps de support et un ensemble adhésif sec (240) fixé au corps de support, l'ensemble adhésif sec ayant un ou plusieurs éléments adhésifs secs (121), le ou les éléments adhésifs secs supportant le substrat au niveau de la surface arrière au moins dans une région centrale et une région externe. |
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L'invention concerne un support de substrat (100) pour supporter un substrat (101) ayant une surface avant (102) à traiter et une surface arrière (115) opposée. Le support de substrat comprend un corps de support et un ensemble adhésif sec (240) fixé au corps de support, l'ensemble adhésif sec ayant un ou plusieurs éléments adhésifs secs (121), le ou les éléments adhésifs secs supportant le substrat au niveau de la surface arrière au moins dans une région centrale et une région externe.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190523&DB=EPODOC&CC=WO&NR=2019096426A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190523&DB=EPODOC&CC=WO&NR=2019096426A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HELLMICH, Anke</creatorcontrib><creatorcontrib>HINTERSCHUSTER, Reiner</creatorcontrib><creatorcontrib>LAU, Simon</creatorcontrib><title>SUBSTRATE PROCESS ARRANGEMENT AND METHOD FOR HOLDING A SUBSTRATE</title><description>A substrate support (100) for supporting a substrate (101) having a front surface (102) to be processed and an opposing back surface (115) is described. The substrate support includes a support body and a dry adhesive assembly (240) attached to the support body, the dry adhesive assembly having one or more dry adhesive elements (121), wherein the one or more dry adhesive elements support the substrate at the back surface in at least a center region and an outer region.
L'invention concerne un support de substrat (100) pour supporter un substrat (101) ayant une surface avant (102) à traiter et une surface arrière (115) opposée. Le support de substrat comprend un corps de support et un ensemble adhésif sec (240) fixé au corps de support, l'ensemble adhésif sec ayant un ou plusieurs éléments adhésifs secs (121), le ou les éléments adhésifs secs supportant le substrat au niveau de la surface arrière au moins dans une région centrale et une région externe.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAIDnUKDglyDHFVCAjyd3YNDlZwDApy9HN39XX1C1Fw9HNR8HUN8fB3UXDzD1Lw8Pdx8fRzV3BUgGvjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBoaWBpZmJkZmjobGxKkCAGddK7M</recordid><startdate>20190523</startdate><enddate>20190523</enddate><creator>HELLMICH, Anke</creator><creator>HINTERSCHUSTER, Reiner</creator><creator>LAU, Simon</creator><scope>EVB</scope></search><sort><creationdate>20190523</creationdate><title>SUBSTRATE PROCESS ARRANGEMENT AND METHOD FOR HOLDING A SUBSTRATE</title><author>HELLMICH, Anke ; HINTERSCHUSTER, Reiner ; LAU, Simon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2019096426A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>HELLMICH, Anke</creatorcontrib><creatorcontrib>HINTERSCHUSTER, Reiner</creatorcontrib><creatorcontrib>LAU, Simon</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HELLMICH, Anke</au><au>HINTERSCHUSTER, Reiner</au><au>LAU, Simon</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESS ARRANGEMENT AND METHOD FOR HOLDING A SUBSTRATE</title><date>2019-05-23</date><risdate>2019</risdate><abstract>A substrate support (100) for supporting a substrate (101) having a front surface (102) to be processed and an opposing back surface (115) is described. The substrate support includes a support body and a dry adhesive assembly (240) attached to the support body, the dry adhesive assembly having one or more dry adhesive elements (121), wherein the one or more dry adhesive elements support the substrate at the back surface in at least a center region and an outer region.
L'invention concerne un support de substrat (100) pour supporter un substrat (101) ayant une surface avant (102) à traiter et une surface arrière (115) opposée. Le support de substrat comprend un corps de support et un ensemble adhésif sec (240) fixé au corps de support, l'ensemble adhésif sec ayant un ou plusieurs éléments adhésifs secs (121), le ou les éléments adhésifs secs supportant le substrat au niveau de la surface arrière au moins dans une région centrale et une région externe.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SUBSTRATE PROCESS ARRANGEMENT AND METHOD FOR HOLDING A SUBSTRATE |
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