PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD
Disclosed are a photosensitive polymer used in the display, semiconductor, and MEMS processes, a photoresist composition using the same, and a pattern forming method using the same. Provided is a polymer comprising a repeat unit represented by chemical formula 1, a repeat unit represented by chemica...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; kor |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OH, Kyeong Il LEE, Chi Hwan PARK, Joo Young KIM, Jae Hyun OH, Seung Keun |
| description | Disclosed are a photosensitive polymer used in the display, semiconductor, and MEMS processes, a photoresist composition using the same, and a pattern forming method using the same. Provided is a polymer comprising a repeat unit represented by chemical formula 1, a repeat unit represented by chemical formula 2, and a repeat unit represented by chemical formula 3.
L'invention concerne un polymère photosensible utilisé dans les procédés d'affichage, de semi-conducteur et de MEMS, une composition de résine photosensible l'utilisant, et un procédé de formation de motif l'utilisant. L'invention concerne un polymère comprenant une unité récurrente représentée par la formule chimique (1), une unité récurrente représentée par la formule chimique (2); et une unité récurrente représentée par la formule chimique (3).
디스플레이, 반도체 및 MEMS 공정에서 사용되는 감광성 고분자, 이를 이용한 포토레지스트 조성물 및 이를 이용한 패턴형성 방법이 개시된다. 상기 화학식 1로 표시되는 반복단위, 화학식 2로 표시되는 반복단위 및 화학식 3으로 표시되는 반복단위를 포함하는 고분자를 제공한다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2019093766A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2019093766A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2019093766A23</originalsourceid><addsrcrecordid>eNrjZAgL8PAP8Q929Qv2DPEMc1UI8PeJ9HUN0lEAiwe5BnsGhyg4-_sG-IMU-PsphAZ7-rkrBDv6uuooOPq5KAQ4hoS4BvkpuPkH-YJkfF1DPPxdeBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGhpYGlsbmZmaORMXGqALueMlE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD</title><source>esp@cenet</source><creator>OH, Kyeong Il ; LEE, Chi Hwan ; PARK, Joo Young ; KIM, Jae Hyun ; OH, Seung Keun</creator><creatorcontrib>OH, Kyeong Il ; LEE, Chi Hwan ; PARK, Joo Young ; KIM, Jae Hyun ; OH, Seung Keun</creatorcontrib><description>Disclosed are a photosensitive polymer used in the display, semiconductor, and MEMS processes, a photoresist composition using the same, and a pattern forming method using the same. Provided is a polymer comprising a repeat unit represented by chemical formula 1, a repeat unit represented by chemical formula 2, and a repeat unit represented by chemical formula 3.
L'invention concerne un polymère photosensible utilisé dans les procédés d'affichage, de semi-conducteur et de MEMS, une composition de résine photosensible l'utilisant, et un procédé de formation de motif l'utilisant. L'invention concerne un polymère comprenant une unité récurrente représentée par la formule chimique (1), une unité récurrente représentée par la formule chimique (2); et une unité récurrente représentée par la formule chimique (3).
디스플레이, 반도체 및 MEMS 공정에서 사용되는 감광성 고분자, 이를 이용한 포토레지스트 조성물 및 이를 이용한 패턴형성 방법이 개시된다. 상기 화학식 1로 표시되는 반복단위, 화학식 2로 표시되는 반복단위 및 화학식 3으로 표시되는 반복단위를 포함하는 고분자를 제공한다.</description><language>eng ; fre ; kor</language><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190516&DB=EPODOC&CC=WO&NR=2019093766A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190516&DB=EPODOC&CC=WO&NR=2019093766A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OH, Kyeong Il</creatorcontrib><creatorcontrib>LEE, Chi Hwan</creatorcontrib><creatorcontrib>PARK, Joo Young</creatorcontrib><creatorcontrib>KIM, Jae Hyun</creatorcontrib><creatorcontrib>OH, Seung Keun</creatorcontrib><title>PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD</title><description>Disclosed are a photosensitive polymer used in the display, semiconductor, and MEMS processes, a photoresist composition using the same, and a pattern forming method using the same. Provided is a polymer comprising a repeat unit represented by chemical formula 1, a repeat unit represented by chemical formula 2, and a repeat unit represented by chemical formula 3.
L'invention concerne un polymère photosensible utilisé dans les procédés d'affichage, de semi-conducteur et de MEMS, une composition de résine photosensible l'utilisant, et un procédé de formation de motif l'utilisant. L'invention concerne un polymère comprenant une unité récurrente représentée par la formule chimique (1), une unité récurrente représentée par la formule chimique (2); et une unité récurrente représentée par la formule chimique (3).
디스플레이, 반도체 및 MEMS 공정에서 사용되는 감광성 고분자, 이를 이용한 포토레지스트 조성물 및 이를 이용한 패턴형성 방법이 개시된다. 상기 화학식 1로 표시되는 반복단위, 화학식 2로 표시되는 반복단위 및 화학식 3으로 표시되는 반복단위를 포함하는 고분자를 제공한다.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgL8PAP8Q929Qv2DPEMc1UI8PeJ9HUN0lEAiwe5BnsGhyg4-_sG-IMU-PsphAZ7-rkrBDv6uuooOPq5KAQ4hoS4BvkpuPkH-YJkfF1DPPxdeBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGhpYGlsbmZmaORMXGqALueMlE</recordid><startdate>20190516</startdate><enddate>20190516</enddate><creator>OH, Kyeong Il</creator><creator>LEE, Chi Hwan</creator><creator>PARK, Joo Young</creator><creator>KIM, Jae Hyun</creator><creator>OH, Seung Keun</creator><scope>EVB</scope></search><sort><creationdate>20190516</creationdate><title>PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD</title><author>OH, Kyeong Il ; LEE, Chi Hwan ; PARK, Joo Young ; KIM, Jae Hyun ; OH, Seung Keun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2019093766A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2019</creationdate><toplevel>online_resources</toplevel><creatorcontrib>OH, Kyeong Il</creatorcontrib><creatorcontrib>LEE, Chi Hwan</creatorcontrib><creatorcontrib>PARK, Joo Young</creatorcontrib><creatorcontrib>KIM, Jae Hyun</creatorcontrib><creatorcontrib>OH, Seung Keun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OH, Kyeong Il</au><au>LEE, Chi Hwan</au><au>PARK, Joo Young</au><au>KIM, Jae Hyun</au><au>OH, Seung Keun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD</title><date>2019-05-16</date><risdate>2019</risdate><abstract>Disclosed are a photosensitive polymer used in the display, semiconductor, and MEMS processes, a photoresist composition using the same, and a pattern forming method using the same. Provided is a polymer comprising a repeat unit represented by chemical formula 1, a repeat unit represented by chemical formula 2, and a repeat unit represented by chemical formula 3.
L'invention concerne un polymère photosensible utilisé dans les procédés d'affichage, de semi-conducteur et de MEMS, une composition de résine photosensible l'utilisant, et un procédé de formation de motif l'utilisant. L'invention concerne un polymère comprenant une unité récurrente représentée par la formule chimique (1), une unité récurrente représentée par la formule chimique (2); et une unité récurrente représentée par la formule chimique (3).
디스플레이, 반도체 및 MEMS 공정에서 사용되는 감광성 고분자, 이를 이용한 포토레지스트 조성물 및 이를 이용한 패턴형성 방법이 개시된다. 상기 화학식 1로 표시되는 반복단위, 화학식 2로 표시되는 반복단위 및 화학식 3으로 표시되는 반복단위를 포함하는 고분자를 제공한다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; kor |
| recordid | cdi_epo_espacenet_WO2019093766A2 |
| source | esp@cenet |
| title | PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T07%3A56%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OH,%20Kyeong%20Il&rft.date=2019-05-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2019093766A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |