THERMAL MANAGEMENT IN INTEGRATED CIRCUIT USING PHONONIC BANDGAP STRUCTURE

An encapsulated integrated circuit (100) includes an integrated circuit die (IC) (102). An encapsulation material (123) encapsulates the IC die (102). A phononic bandgap structure (121, 122) is included within the encapsulation material (123) that is configured to have a phononic bandgap with a freq...

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Bibliographische Detailangaben

Hauptverfasser:	REVIER, Daniel, COOK, Benjamin
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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