SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHANCED PACKAGE THERMOMECHANICS

A device package and a method of forming a device package are described. The device package includes a plurality of posts disposed on a substrate. Each post has a top surface and a bottom surface that is opposite from the top surface. The device package also has one or more dies disposed on the subs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SWAN, Johanna M, CHAN ARGUEDAS, Sergio A, PADMANABHAN RAMALEKSHMI THANU, Dinesh, EDI, Feras, BEATTY, John J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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