METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

This method for manufacturing an electronic component is characterized by being provided with: a step for forming, on a substrate, a base layer that has a first metal film comprising Cu, Fe, Ag, or an alloy having any of these as a main component, and subsequently forming, on the outermost layer, a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HATASE, Minoru
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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