INTEGRATED CIRCUIT PACKAGES WITH PLATES

Disclosed herein are integrated circuit (IC) packages with plates, as well as related devices and methods. For example, in some embodiments, an IC package may include: a package substrate; a plurality of electrical components secured to a face of the package substrate; and a plate secured to the plu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CETEGEN, Edvin, KARHADE, Omkar G, SANE, Sandeep B
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!