INTEGRATED CIRCUIT PACKAGES WITH PLATES
Disclosed herein are integrated circuit (IC) packages with plates, as well as related devices and methods. For example, in some embodiments, an IC package may include: a package substrate; a plurality of electrical components secured to a face of the package substrate; and a plate secured to the plu...
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| creator | CETEGEN, Edvin KARHADE, Omkar G SANE, Sandeep B |
| description | Disclosed herein are integrated circuit (IC) packages with plates, as well as related devices and methods. For example, in some embodiments, an IC package may include: a package substrate; a plurality of electrical components secured to a face of the package substrate; and a plate secured to the plurality of electrical components with an adhesive such that the plurality of electrical components are between the plate and the package substrate.
La présente invention concerne des boîtiers de circuits intégrés (CI) dotés de plaques, ainsi que des dispositifs et des procédés associés. Par exemple, dans certains modes de réalisation, un boîtier de CI peut comprendre : un substrat de boîtier ; une pluralité de composants électriques fixés à une face du substrat de boîtier ; et une plaque fixée à la pluralité de composants électriques ayant un adhésif de telle sorte que la pluralité de composants électriques se trouve entre la plaque et le substrat de boîtier. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2018111249A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2018111249A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2018111249A13</originalsourceid><addsrcrecordid>eNrjZFD39AtxdQ9yDHF1UXD2DHIO9QxRCHB09nZ0dw1WCPcM8VAI8AFKBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDQwtDQ0MjE0tHQ2PiVAEAdEIktg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INTEGRATED CIRCUIT PACKAGES WITH PLATES</title><source>esp@cenet</source><creator>CETEGEN, Edvin ; KARHADE, Omkar G ; SANE, Sandeep B</creator><creatorcontrib>CETEGEN, Edvin ; KARHADE, Omkar G ; SANE, Sandeep B</creatorcontrib><description>Disclosed herein are integrated circuit (IC) packages with plates, as well as related devices and methods. For example, in some embodiments, an IC package may include: a package substrate; a plurality of electrical components secured to a face of the package substrate; and a plate secured to the plurality of electrical components with an adhesive such that the plurality of electrical components are between the plate and the package substrate.
La présente invention concerne des boîtiers de circuits intégrés (CI) dotés de plaques, ainsi que des dispositifs et des procédés associés. Par exemple, dans certains modes de réalisation, un boîtier de CI peut comprendre : un substrat de boîtier ; une pluralité de composants électriques fixés à une face du substrat de boîtier ; et une plaque fixée à la pluralité de composants électriques ayant un adhésif de telle sorte que la pluralité de composants électriques se trouve entre la plaque et le substrat de boîtier.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180621&DB=EPODOC&CC=WO&NR=2018111249A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180621&DB=EPODOC&CC=WO&NR=2018111249A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CETEGEN, Edvin</creatorcontrib><creatorcontrib>KARHADE, Omkar G</creatorcontrib><creatorcontrib>SANE, Sandeep B</creatorcontrib><title>INTEGRATED CIRCUIT PACKAGES WITH PLATES</title><description>Disclosed herein are integrated circuit (IC) packages with plates, as well as related devices and methods. For example, in some embodiments, an IC package may include: a package substrate; a plurality of electrical components secured to a face of the package substrate; and a plate secured to the plurality of electrical components with an adhesive such that the plurality of electrical components are between the plate and the package substrate.
La présente invention concerne des boîtiers de circuits intégrés (CI) dotés de plaques, ainsi que des dispositifs et des procédés associés. Par exemple, dans certains modes de réalisation, un boîtier de CI peut comprendre : un substrat de boîtier ; une pluralité de composants électriques fixés à une face du substrat de boîtier ; et une plaque fixée à la pluralité de composants électriques ayant un adhésif de telle sorte que la pluralité de composants électriques se trouve entre la plaque et le substrat de boîtier.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD39AtxdQ9yDHF1UXD2DHIO9QxRCHB09nZ0dw1WCPcM8VAI8AFKBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDQwtDQ0MjE0tHQ2PiVAEAdEIktg</recordid><startdate>20180621</startdate><enddate>20180621</enddate><creator>CETEGEN, Edvin</creator><creator>KARHADE, Omkar G</creator><creator>SANE, Sandeep B</creator><scope>EVB</scope></search><sort><creationdate>20180621</creationdate><title>INTEGRATED CIRCUIT PACKAGES WITH PLATES</title><author>CETEGEN, Edvin ; KARHADE, Omkar G ; SANE, Sandeep B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2018111249A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CETEGEN, Edvin</creatorcontrib><creatorcontrib>KARHADE, Omkar G</creatorcontrib><creatorcontrib>SANE, Sandeep B</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CETEGEN, Edvin</au><au>KARHADE, Omkar G</au><au>SANE, Sandeep B</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTEGRATED CIRCUIT PACKAGES WITH PLATES</title><date>2018-06-21</date><risdate>2018</risdate><abstract>Disclosed herein are integrated circuit (IC) packages with plates, as well as related devices and methods. For example, in some embodiments, an IC package may include: a package substrate; a plurality of electrical components secured to a face of the package substrate; and a plate secured to the plurality of electrical components with an adhesive such that the plurality of electrical components are between the plate and the package substrate.
La présente invention concerne des boîtiers de circuits intégrés (CI) dotés de plaques, ainsi que des dispositifs et des procédés associés. Par exemple, dans certains modes de réalisation, un boîtier de CI peut comprendre : un substrat de boîtier ; une pluralité de composants électriques fixés à une face du substrat de boîtier ; et une plaque fixée à la pluralité de composants électriques ayant un adhésif de telle sorte que la pluralité de composants électriques se trouve entre la plaque et le substrat de boîtier.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | INTEGRATED CIRCUIT PACKAGES WITH PLATES |
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