CHIP PACKAGE AND METHOD FOR PRODUCING SAME

Disclosed are a chip package having a molding layer containing conductive powder and a method for producing the chip package. A molding layer and a conductive layer are formed in a thru-hole of a frame. Also, a first via layer having the same material as the molding layer is formed in a via hole of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOON, Mina, LEE, Junkyu, KWON, Yongtae, LEE, Jaecheon
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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