CHIP PACKAGE AND METHOD FOR PRODUCING SAME
Disclosed are a chip package having a molding layer containing conductive powder and a method for producing the chip package. A molding layer and a conductive layer are formed in a thru-hole of a frame. Also, a first via layer having the same material as the molding layer is formed in a via hole of...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YOON, Mina LEE, Junkyu KWON, Yongtae LEE, Jaecheon |
| description | Disclosed are a chip package having a molding layer containing conductive powder and a method for producing the chip package. A molding layer and a conductive layer are formed in a thru-hole of a frame. Also, a first via layer having the same material as the molding layer is formed in a via hole of the frame, and a second via layer having the same material as the conductive layer is formed over the first via layer. The molding layer and the conductive layer can facilitate the emission of the heat generated from a chip and block electromagnetic waves coming from the outside.
L'invention concerne un boîtier de puce ayant une couche de moulage contenant une poudre conductrice et un procédé de production du boîtier de puce. Une couche de moulage et une couche conductrice sont formées dans un trou traversant d'un cadre. En outre, une première couche d'interconnexion ayant le même matériau que la couche de moulage est formée dans un trou d'interconnexion du cadre, et une seconde couche d'interconnexion ayant le même matériau que la couche conductrice est formée sur la première couche d'interconnexion. La couche de moulage et la couche conductrice peuvent faciliter l'émission de la chaleur générée à partir d'une puce et bloquer des ondes électromagnétiques provenant de l'extérieur.
도전성 분말이 함유된 몰딩층이 형성된 칩 패키지 및 그 제조방법이 개시된다. 프레임의 관통홀에는 몰딩층과 도전층이 형성된다. 또한, 프레임에 형성된 비아홀에는 몰딩층과 동일한 재질을 가지는 제1 비아층이 형성되고, 제1 비아층 상에는 도전층과 동일한 재질을 가지는 제2 비아층이 형성된다. 몰딩층 및 도전층에 의해 칩에서 발생되는 열의 방출은 용이해지고, 외부로부터의 전자파는 차폐될 수 있다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2018097412A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2018097412A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2018097412A13</originalsourceid><addsrcrecordid>eNrjZNBy9vAMUAhwdPZ2dHdVcPRzUfB1DfHwd1Fw8w9SCAjydwl19vRzVwh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBoYWBpbmJoZGjobGxKkCAK2_JSE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CHIP PACKAGE AND METHOD FOR PRODUCING SAME</title><source>esp@cenet</source><creator>YOON, Mina ; LEE, Junkyu ; KWON, Yongtae ; LEE, Jaecheon</creator><creatorcontrib>YOON, Mina ; LEE, Junkyu ; KWON, Yongtae ; LEE, Jaecheon</creatorcontrib><description>Disclosed are a chip package having a molding layer containing conductive powder and a method for producing the chip package. A molding layer and a conductive layer are formed in a thru-hole of a frame. Also, a first via layer having the same material as the molding layer is formed in a via hole of the frame, and a second via layer having the same material as the conductive layer is formed over the first via layer. The molding layer and the conductive layer can facilitate the emission of the heat generated from a chip and block electromagnetic waves coming from the outside.
L'invention concerne un boîtier de puce ayant une couche de moulage contenant une poudre conductrice et un procédé de production du boîtier de puce. Une couche de moulage et une couche conductrice sont formées dans un trou traversant d'un cadre. En outre, une première couche d'interconnexion ayant le même matériau que la couche de moulage est formée dans un trou d'interconnexion du cadre, et une seconde couche d'interconnexion ayant le même matériau que la couche conductrice est formée sur la première couche d'interconnexion. La couche de moulage et la couche conductrice peuvent faciliter l'émission de la chaleur générée à partir d'une puce et bloquer des ondes électromagnétiques provenant de l'extérieur.
도전성 분말이 함유된 몰딩층이 형성된 칩 패키지 및 그 제조방법이 개시된다. 프레임의 관통홀에는 몰딩층과 도전층이 형성된다. 또한, 프레임에 형성된 비아홀에는 몰딩층과 동일한 재질을 가지는 제1 비아층이 형성되고, 제1 비아층 상에는 도전층과 동일한 재질을 가지는 제2 비아층이 형성된다. 몰딩층 및 도전층에 의해 칩에서 발생되는 열의 방출은 용이해지고, 외부로부터의 전자파는 차폐될 수 있다.</description><language>eng ; fre ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180531&DB=EPODOC&CC=WO&NR=2018097412A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180531&DB=EPODOC&CC=WO&NR=2018097412A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOON, Mina</creatorcontrib><creatorcontrib>LEE, Junkyu</creatorcontrib><creatorcontrib>KWON, Yongtae</creatorcontrib><creatorcontrib>LEE, Jaecheon</creatorcontrib><title>CHIP PACKAGE AND METHOD FOR PRODUCING SAME</title><description>Disclosed are a chip package having a molding layer containing conductive powder and a method for producing the chip package. A molding layer and a conductive layer are formed in a thru-hole of a frame. Also, a first via layer having the same material as the molding layer is formed in a via hole of the frame, and a second via layer having the same material as the conductive layer is formed over the first via layer. The molding layer and the conductive layer can facilitate the emission of the heat generated from a chip and block electromagnetic waves coming from the outside.
L'invention concerne un boîtier de puce ayant une couche de moulage contenant une poudre conductrice et un procédé de production du boîtier de puce. Une couche de moulage et une couche conductrice sont formées dans un trou traversant d'un cadre. En outre, une première couche d'interconnexion ayant le même matériau que la couche de moulage est formée dans un trou d'interconnexion du cadre, et une seconde couche d'interconnexion ayant le même matériau que la couche conductrice est formée sur la première couche d'interconnexion. La couche de moulage et la couche conductrice peuvent faciliter l'émission de la chaleur générée à partir d'une puce et bloquer des ondes électromagnétiques provenant de l'extérieur.
도전성 분말이 함유된 몰딩층이 형성된 칩 패키지 및 그 제조방법이 개시된다. 프레임의 관통홀에는 몰딩층과 도전층이 형성된다. 또한, 프레임에 형성된 비아홀에는 몰딩층과 동일한 재질을 가지는 제1 비아층이 형성되고, 제1 비아층 상에는 도전층과 동일한 재질을 가지는 제2 비아층이 형성된다. 몰딩층 및 도전층에 의해 칩에서 발생되는 열의 방출은 용이해지고, 외부로부터의 전자파는 차폐될 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBy9vAMUAhwdPZ2dHdVcPRzUfB1DfHwd1Fw8w9SCAjydwl19vRzVwh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBoYWBpbmJoZGjobGxKkCAK2_JSE</recordid><startdate>20180531</startdate><enddate>20180531</enddate><creator>YOON, Mina</creator><creator>LEE, Junkyu</creator><creator>KWON, Yongtae</creator><creator>LEE, Jaecheon</creator><scope>EVB</scope></search><sort><creationdate>20180531</creationdate><title>CHIP PACKAGE AND METHOD FOR PRODUCING SAME</title><author>YOON, Mina ; LEE, Junkyu ; KWON, Yongtae ; LEE, Jaecheon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2018097412A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YOON, Mina</creatorcontrib><creatorcontrib>LEE, Junkyu</creatorcontrib><creatorcontrib>KWON, Yongtae</creatorcontrib><creatorcontrib>LEE, Jaecheon</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOON, Mina</au><au>LEE, Junkyu</au><au>KWON, Yongtae</au><au>LEE, Jaecheon</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHIP PACKAGE AND METHOD FOR PRODUCING SAME</title><date>2018-05-31</date><risdate>2018</risdate><abstract>Disclosed are a chip package having a molding layer containing conductive powder and a method for producing the chip package. A molding layer and a conductive layer are formed in a thru-hole of a frame. Also, a first via layer having the same material as the molding layer is formed in a via hole of the frame, and a second via layer having the same material as the conductive layer is formed over the first via layer. The molding layer and the conductive layer can facilitate the emission of the heat generated from a chip and block electromagnetic waves coming from the outside.
L'invention concerne un boîtier de puce ayant une couche de moulage contenant une poudre conductrice et un procédé de production du boîtier de puce. Une couche de moulage et une couche conductrice sont formées dans un trou traversant d'un cadre. En outre, une première couche d'interconnexion ayant le même matériau que la couche de moulage est formée dans un trou d'interconnexion du cadre, et une seconde couche d'interconnexion ayant le même matériau que la couche conductrice est formée sur la première couche d'interconnexion. La couche de moulage et la couche conductrice peuvent faciliter l'émission de la chaleur générée à partir d'une puce et bloquer des ondes électromagnétiques provenant de l'extérieur.
도전성 분말이 함유된 몰딩층이 형성된 칩 패키지 및 그 제조방법이 개시된다. 프레임의 관통홀에는 몰딩층과 도전층이 형성된다. 또한, 프레임에 형성된 비아홀에는 몰딩층과 동일한 재질을 가지는 제1 비아층이 형성되고, 제1 비아층 상에는 도전층과 동일한 재질을 가지는 제2 비아층이 형성된다. 몰딩층 및 도전층에 의해 칩에서 발생되는 열의 방출은 용이해지고, 외부로부터의 전자파는 차폐될 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; kor |
| recordid | cdi_epo_espacenet_WO2018097412A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | CHIP PACKAGE AND METHOD FOR PRODUCING SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T03%3A56%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOON,%20Mina&rft.date=2018-05-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2018097412A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |