METHOD FOR FORMING THERMAL INKJET PRINTHEAD, THERMAL INKJET PRINTHEAD, AND SEMICONDUCTOR WAFER

The present invention provides a method for forming a thermal inkjet printhead, comprising at least the following steps: providing a semiconductor wafer including an integrated electronic circuit and a section for forming a thermal actuator element, the integrated circuit comprising at least: a ther...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DISEGNA, Irma, SCHINA, Paolo, BALDI, Silvia, PERINI, Miriam
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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