LAMINATED MULTI-PLY TISSUE PRODUCTS WITH IMPROVED SOFTNESS AND PLY BONDING

Multi-ply tissue products having improved ply bonding, moldability and drape and method for making those products are described. The method comprise producing a multi-ply adhesively bonded product comprising a pattern of uniformly space microembossed elements (having a dimeter in the range of 0.014-...

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Bibliographische Detailangaben
1. Verfasser:	DWIGGINS, John H
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	IMPREGNATING OR COATING OF PAPER LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER METHODS OF PRODUCING PAPER THEREON PAPER NOT OTHERWISE PROVIDED FOR PAPER-MAKING PAPER-MAKING MACHINES PERFORMING OPERATIONS PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D PRODUCTION OF CELLULOSE PULP COMPOSITIONS TEXTILES TRANSPORTING TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER
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Beschreibung
Zusammenfassung:	Multi-ply tissue products having improved ply bonding, moldability and drape and method for making those products are described. The method comprise producing a multi-ply adhesively bonded product comprising a pattern of uniformly space microembossed elements (having a dimeter in the range of 0.014-0.021 inches) with a bond area ranging between 0.07% to 2% of the total surface area of a ply. La présente invention concerne des produits de tissu multicouche ayant une liaison entre couches, une aptitude au moulage et un drapé améliorés et un procédé de fabrication de ces produits. Le procédé consiste à produire un produit multicouche lié par collage comprenant un motif d'éléments microgaufrés uniformément espacés (ayant un diamètre dans la plage de 0,014 à 0,021 pouce) comprenant une zone de liaison comprise entre 0,07 % et 2 % de la surface totale d'une couche.