SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a recta...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BRAZEL, Michael S, AOKI, Russell S, JASNIEWSKI, Joseph J, FERGUSON, Shelby A, HUI, Michael R, VALPIANI, Anthony P, CARTER, Daniel P, KOFSTAD, Harvey R, CARSTENS, Jonathon R, BOYD, Thomas A, YEE, Rashelle
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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