INTERPOSER-LESS STACK DIE INTERCONNECT

Techniques for providing a semiconductor assembly having an interconnect die (106) for die-to-die interconnection, an IC package (100), a method for manufacturing, and a method for routing signals in an IC package are described. In one implementation, a semiconductor assembly is provided that includ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	O'ROURKE, Glenn, MAJUMDAR, Amitava, CHAWARE, Raghunandan, SINGH, Inderjit
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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