EVAPORATIVE DEPOSITION WITH IMPROVED DEPOSITION SOURCE

Disclosed is a deposition source for an evaporative deposition vacuum vessel and a method of evaporative deposition wherein a first receptacle is provided including a charge of a first material supported by the first receptacle. The first receptacle is heated to a temperature sufficient to evaporate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HEYDEMANN, Volker D, BUCCI, Brian, Arthur, DECKER, Wolfgang
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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