MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING
A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling m...
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| creator | MILNE, Jason G |
| description | A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.
Dispositif de dissipation de chaleur comprenant au moins une surface de dissipation de chaleur et un mécanisme de refroidissement de micro-taille formé directement sur la surface de dissipation de chaleur par un processus de fabrication additive. Le mécanisme de refroidissement comprend au moins un passage de fluide, tel qu'un micro-tuyau, pour transporter un milieu de refroidissement depuis une source de liquide de de refroidissement directement jusqu'à la surface de dissipation de chaleur. Le mécanisme de refroidissement est étanche aux fluides vis-à-vis de la surface de dissipation de chaleur de telle sorte que le milieu de refroidissement est en contact thermique directement avec la surface de dissipation de chaleur. |
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Dispositif de dissipation de chaleur comprenant au moins une surface de dissipation de chaleur et un mécanisme de refroidissement de micro-taille formé directement sur la surface de dissipation de chaleur par un processus de fabrication additive. Le mécanisme de refroidissement comprend au moins un passage de fluide, tel qu'un micro-tuyau, pour transporter un milieu de refroidissement depuis une source de liquide de de refroidissement directement jusqu'à la surface de dissipation de chaleur. Le mécanisme de refroidissement est étanche aux fluides vis-à-vis de la surface de dissipation de chaleur de telle sorte que le milieu de refroidissement est en contact thermique directement avec la surface de dissipation de chaleur.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161208&DB=EPODOC&CC=WO&NR=2016196929A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161208&DB=EPODOC&CC=WO&NR=2016196929A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MILNE, Jason G</creatorcontrib><title>MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING</title><description>A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.
Dispositif de dissipation de chaleur comprenant au moins une surface de dissipation de chaleur et un mécanisme de refroidissement de micro-taille formé directement sur la surface de dissipation de chaleur par un processus de fabrication additive. Le mécanisme de refroidissement comprend au moins un passage de fluide, tel qu'un micro-tuyau, pour transporter un milieu de refroidissement depuis une source de liquide de de refroidissement directement jusqu'à la surface de dissipation de chaleur. Le mécanisme de refroidissement est étanche aux fluides vis-à-vis de la surface de dissipation de chaleur de telle sorte que le milieu de refroidissement est en contact thermique directement avec la surface de dissipation de chaleur.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD29XQO8tf18A92DVZw8w9S8PQLcXUPcgxxdVFw9gxyDvUMUXD0c1FwcQ3zdHZV8HENc_VRcPb39_H0c-dhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGhmaGlmaWRpaORsbEqQIAbqkqHg</recordid><startdate>20161208</startdate><enddate>20161208</enddate><creator>MILNE, Jason G</creator><scope>EVB</scope></search><sort><creationdate>20161208</creationdate><title>MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING</title><author>MILNE, Jason G</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2016196929A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MILNE, Jason G</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MILNE, Jason G</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING</title><date>2016-12-08</date><risdate>2016</risdate><abstract>A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.
Dispositif de dissipation de chaleur comprenant au moins une surface de dissipation de chaleur et un mécanisme de refroidissement de micro-taille formé directement sur la surface de dissipation de chaleur par un processus de fabrication additive. Le mécanisme de refroidissement comprend au moins un passage de fluide, tel qu'un micro-tuyau, pour transporter un milieu de refroidissement depuis une source de liquide de de refroidissement directement jusqu'à la surface de dissipation de chaleur. Le mécanisme de refroidissement est étanche aux fluides vis-à-vis de la surface de dissipation de chaleur de telle sorte que le milieu de refroidissement est en contact thermique directement avec la surface de dissipation de chaleur.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING |
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