A TWO PART (2K) EPOXY ADHESIVE COMPOSITION FOR BONDING OILY METALS

A novel 2K adhesive composition with its epoxy resin part comprising an organic polymeric solid containing a vinyl phenol moiety. Such adhesive composition provides a strong bond to oil-contaminated metal substrates when cured at room temperature, while simultaneously exhibiting good impact toughnes...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	BALIJEPALLI, Bharati
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A novel 2K adhesive composition with its epoxy resin part comprising an organic polymeric solid containing a vinyl phenol moiety. Such adhesive composition provides a strong bond to oil-contaminated metal substrates when cured at room temperature, while simultaneously exhibiting good impact toughness. L'invention concerne une nouvelle composition adhésive 2K dont le composant de résine époxyde comprend un solide polymère organique contenant une fraction phénolique vinylique. Ladite composition adhésive permet d'obtenir une forte liaison à des substrats métalliques contaminés par de l'huile, lorsqu'elle durcit à température ambiante, tout en présentant simultanément une bonne résistance aux chocs.