PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Provided is a photosensitive resin composition containing (A) component: a binder polymer, (B) component: a photopolymerizable compound, and (C) component: a photopolymerization initiator, the (C) component including (C-1) component: an acridine compound and (C-2) component: a compound having an oxi...

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Bibliographische Detailangaben
Hauptverfasser: USUBA Manami, ITAGAKI Shuuichi, NAGOSHI Toshimasa, YUI Motoaki
Format: Patent
Sprache:eng ; fre ; jpn
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Zusammenfassung:Provided is a photosensitive resin composition containing (A) component: a binder polymer, (B) component: a photopolymerizable compound, and (C) component: a photopolymerization initiator, the (C) component including (C-1) component: an acridine compound and (C-2) component: a compound having an oxime ester group. L'invention concerne une composition de résine photosensible contenant un composant (A) : un polymère liant, un composant (B) : un composé photopolymérisable, ainsi qu'un composant (C) : un initiateur de photopolymérisation. Le composant (C) contient un composant (C-1) : un composé d'acridine, ainsi qu'un composant (C-2) : un composé contenant un groupe ester d'oxime. (A)成分:バインダーポリマー、(B)成分:光重合性化合物、及び、(C)成分:光重合開始剤を含有し、前記(C)成分として、(C-1)成分:アクリジン化合物、及び、(C-2)成分:オキシムエステル基を有する化合物を含有する、感光性樹脂組成物。