FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD

Provided is a method for manufacturing a flexible laminated board, comprising: a step for continuously feeding an insulating film (11) comprising a liquid crystal polymer, and a metal foil (12), between endless belts (23, 24); and a step for thermocompression bonding of the insulating film (11) and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TACHIBANA, EISUKE, SUZUKI, TARO, TOTANI, MAKOTO, ARIMA, TAKAO, KONDOH, KOUJI, MIYAGAWA, EIJIROU, KASAHARA, JUNYA
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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