MEMS-BASED ACTIVE COOLING SYSTEM

In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby produ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FINE, ERAN, SHACHAM-DIAMAND, YOSI, KRYLOV, VIACHESLAV, AXELROD, EKATERINA, BEN-DAVID, MORDECHAI, HERMON, ZIV
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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