MEMS-BASED ACTIVE COOLING SYSTEM
In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby produ...
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| creator | FINE, ERAN SHACHAM-DIAMAND, YOSI KRYLOV, VIACHESLAV AXELROD, EKATERINA BEN-DAVID, MORDECHAI HERMON, ZIV |
| description | In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.
Dans divers modes de réalisation, un dispositif de refroidissement pour dissiper la chaleur générée dans un dispositif électronique ou électrochimique comprend un substrat, de multiples éléments fléchisseurs prévus sur le substrat, et une circuiterie d'alimentation pour fournir un champ électrique pour actionner les éléments fléchisseurs afin d'en provoquer le mouvement, ce qui permet ainsi de produire un flux d'air. |
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Dans divers modes de réalisation, un dispositif de refroidissement pour dissiper la chaleur générée dans un dispositif électronique ou électrochimique comprend un substrat, de multiples éléments fléchisseurs prévus sur le substrat, et une circuiterie d'alimentation pour fournir un champ électrique pour actionner les éléments fléchisseurs afin d'en provoquer le mouvement, ce qui permet ainsi de produire un flux d'air.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160519&DB=EPODOC&CC=WO&NR=2016075535A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160519&DB=EPODOC&CC=WO&NR=2016075535A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FINE, ERAN</creatorcontrib><creatorcontrib>SHACHAM-DIAMAND, YOSI</creatorcontrib><creatorcontrib>KRYLOV, VIACHESLAV</creatorcontrib><creatorcontrib>AXELROD, EKATERINA</creatorcontrib><creatorcontrib>BEN-DAVID, MORDECHAI</creatorcontrib><creatorcontrib>HERMON, ZIV</creatorcontrib><title>MEMS-BASED ACTIVE COOLING SYSTEM</title><description>In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.
Dans divers modes de réalisation, un dispositif de refroidissement pour dissiper la chaleur générée dans un dispositif électronique ou électrochimique comprend un substrat, de multiples éléments fléchisseurs prévus sur le substrat, et une circuiterie d'alimentation pour fournir un champ électrique pour actionner les éléments fléchisseurs afin d'en provoquer le mouvement, ce qui permet ainsi de produire un flux d'air.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDwdfUN1nVyDHZ1UXB0DvEMc1Vw9vf38fRzVwiODA5x9eVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGhmYG5qamxqaOhsbEqQIAc4cixQ</recordid><startdate>20160519</startdate><enddate>20160519</enddate><creator>FINE, ERAN</creator><creator>SHACHAM-DIAMAND, YOSI</creator><creator>KRYLOV, VIACHESLAV</creator><creator>AXELROD, EKATERINA</creator><creator>BEN-DAVID, MORDECHAI</creator><creator>HERMON, ZIV</creator><scope>EVB</scope></search><sort><creationdate>20160519</creationdate><title>MEMS-BASED ACTIVE COOLING SYSTEM</title><author>FINE, ERAN ; SHACHAM-DIAMAND, YOSI ; KRYLOV, VIACHESLAV ; AXELROD, EKATERINA ; BEN-DAVID, MORDECHAI ; HERMON, ZIV</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2016075535A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FINE, ERAN</creatorcontrib><creatorcontrib>SHACHAM-DIAMAND, YOSI</creatorcontrib><creatorcontrib>KRYLOV, VIACHESLAV</creatorcontrib><creatorcontrib>AXELROD, EKATERINA</creatorcontrib><creatorcontrib>BEN-DAVID, MORDECHAI</creatorcontrib><creatorcontrib>HERMON, ZIV</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FINE, ERAN</au><au>SHACHAM-DIAMAND, YOSI</au><au>KRYLOV, VIACHESLAV</au><au>AXELROD, EKATERINA</au><au>BEN-DAVID, MORDECHAI</au><au>HERMON, ZIV</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MEMS-BASED ACTIVE COOLING SYSTEM</title><date>2016-05-19</date><risdate>2016</risdate><abstract>In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.
Dans divers modes de réalisation, un dispositif de refroidissement pour dissiper la chaleur générée dans un dispositif électronique ou électrochimique comprend un substrat, de multiples éléments fléchisseurs prévus sur le substrat, et une circuiterie d'alimentation pour fournir un champ électrique pour actionner les éléments fléchisseurs afin d'en provoquer le mouvement, ce qui permet ainsi de produire un flux d'air.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | MEMS-BASED ACTIVE COOLING SYSTEM |
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