METHOD OF LASER SCRIBING FIRST AND SECOND TRANSPARENT ELECTRICALLY CONDUCTIVE LAYERS DEPOSITED ON RESPECTIVE OPPOSONG FIRST AND SECOND SURFACES OF A TRANSPARENT SUBSTRATE
The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14') deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising : directing a first laser beam (21) thro...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MILNE, DAVID CHARLES |
| description | The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14') deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising : directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14') and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21') through one or more lenses (22') to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21') passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21') and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21') to scribe a second pattern in the second electrically conductive layer (14').
La présente invention concerne un procédé de gravure au laser de première et seconde couches transparentes électriquement conductrices (14, 14') déposées sur des première et seconde surfaces opposées respectives (12, 13) d'un substrat transparent (11), le procédé comprenant : l'orientation d'un premier faisceau laser (21) à travers une ou plusieurs lentilles (22) vers un point focal sur ou à proximité immédiate de la première surface (12) du substrat (11), de telle sorte que le faisceau laser de focalisation (21) passe à travers la seconde couche électriquement conductrice (14') et la seconde surface (13) du substrat (11) ; l'amorçage d'un mouvement relatif entre le premier faisceau laser (21) et le substrat (11) dans deux axes dans un plan orthogonal à l'axe du premier faisceau laser (21) pour graver un premier motif dans la première couche électriquement conductrice (14) ; l'orientation d'un second faisceau laser (21') à travers une ou plusieurs lentilles (22') vers un point focal sur ou à proximité immédiate de la seconde surface (13) du substrat (11), de telle sorte que le faisceau laser de focalisation (21') passe à travers la |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2016020641A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2016020641A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2016020641A13</originalsourceid><addsrcrecordid>eNqNjrEKwkAQRNNYiPoPC9ZCEiX9edmYg3gXdjeKVQhyVqKB-FV-pRe0ESyshtkZ3s40eu5RSpeDK6BSjASsyWyN3UFhiAWUzYFRuyBCynKtCK0AVqiFjFZVdYIxbbSYAwbGCYkhx9qxEQxcC4Rc4zt2dbi7X3BuqFAaeRyivl5xs-XgBefR5NJdB7_46CxaFii6XPn-3vqh787-5h_t0aVxksVpnG0Slaz_a70Ak9VI-g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF LASER SCRIBING FIRST AND SECOND TRANSPARENT ELECTRICALLY CONDUCTIVE LAYERS DEPOSITED ON RESPECTIVE OPPOSONG FIRST AND SECOND SURFACES OF A TRANSPARENT SUBSTRATE</title><source>esp@cenet</source><creator>MILNE, DAVID CHARLES</creator><creatorcontrib>MILNE, DAVID CHARLES</creatorcontrib><description>The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14') deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising : directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14') and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21') through one or more lenses (22') to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21') passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21') and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21') to scribe a second pattern in the second electrically conductive layer (14').
La présente invention concerne un procédé de gravure au laser de première et seconde couches transparentes électriquement conductrices (14, 14') déposées sur des première et seconde surfaces opposées respectives (12, 13) d'un substrat transparent (11), le procédé comprenant : l'orientation d'un premier faisceau laser (21) à travers une ou plusieurs lentilles (22) vers un point focal sur ou à proximité immédiate de la première surface (12) du substrat (11), de telle sorte que le faisceau laser de focalisation (21) passe à travers la seconde couche électriquement conductrice (14') et la seconde surface (13) du substrat (11) ; l'amorçage d'un mouvement relatif entre le premier faisceau laser (21) et le substrat (11) dans deux axes dans un plan orthogonal à l'axe du premier faisceau laser (21) pour graver un premier motif dans la première couche électriquement conductrice (14) ; l'orientation d'un second faisceau laser (21') à travers une ou plusieurs lentilles (22') vers un point focal sur ou à proximité immédiate de la seconde surface (13) du substrat (11), de telle sorte que le faisceau laser de focalisation (21') passe à travers la première couche électriquement conductrice (14) et la première surface (12) du substrat (11), l'amorçage d'un mouvement relatif entre le second faisceau laser (21') et le substrat (11) dans deux axes dans un plan orthogonal à l'axe du second faisceau laser (21') pour graver un second réseau dans la seconde couche électriquement conductrice (14').</description><language>eng ; fre</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160211&DB=EPODOC&CC=WO&NR=2016020641A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160211&DB=EPODOC&CC=WO&NR=2016020641A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MILNE, DAVID CHARLES</creatorcontrib><title>METHOD OF LASER SCRIBING FIRST AND SECOND TRANSPARENT ELECTRICALLY CONDUCTIVE LAYERS DEPOSITED ON RESPECTIVE OPPOSONG FIRST AND SECOND SURFACES OF A TRANSPARENT SUBSTRATE</title><description>The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14') deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising : directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14') and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21') through one or more lenses (22') to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21') passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21') and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21') to scribe a second pattern in the second electrically conductive layer (14').
La présente invention concerne un procédé de gravure au laser de première et seconde couches transparentes électriquement conductrices (14, 14') déposées sur des première et seconde surfaces opposées respectives (12, 13) d'un substrat transparent (11), le procédé comprenant : l'orientation d'un premier faisceau laser (21) à travers une ou plusieurs lentilles (22) vers un point focal sur ou à proximité immédiate de la première surface (12) du substrat (11), de telle sorte que le faisceau laser de focalisation (21) passe à travers la seconde couche électriquement conductrice (14') et la seconde surface (13) du substrat (11) ; l'amorçage d'un mouvement relatif entre le premier faisceau laser (21) et le substrat (11) dans deux axes dans un plan orthogonal à l'axe du premier faisceau laser (21) pour graver un premier motif dans la première couche électriquement conductrice (14) ; l'orientation d'un second faisceau laser (21') à travers une ou plusieurs lentilles (22') vers un point focal sur ou à proximité immédiate de la seconde surface (13) du substrat (11), de telle sorte que le faisceau laser de focalisation (21') passe à travers la première couche électriquement conductrice (14) et la première surface (12) du substrat (11), l'amorçage d'un mouvement relatif entre le second faisceau laser (21') et le substrat (11) dans deux axes dans un plan orthogonal à l'axe du second faisceau laser (21') pour graver un second réseau dans la seconde couche électriquement conductrice (14').</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjrEKwkAQRNNYiPoPC9ZCEiX9edmYg3gXdjeKVQhyVqKB-FV-pRe0ESyshtkZ3s40eu5RSpeDK6BSjASsyWyN3UFhiAWUzYFRuyBCynKtCK0AVqiFjFZVdYIxbbSYAwbGCYkhx9qxEQxcC4Rc4zt2dbi7X3BuqFAaeRyivl5xs-XgBefR5NJdB7_46CxaFii6XPn-3vqh787-5h_t0aVxksVpnG0Slaz_a70Ak9VI-g</recordid><startdate>20160211</startdate><enddate>20160211</enddate><creator>MILNE, DAVID CHARLES</creator><scope>EVB</scope></search><sort><creationdate>20160211</creationdate><title>METHOD OF LASER SCRIBING FIRST AND SECOND TRANSPARENT ELECTRICALLY CONDUCTIVE LAYERS DEPOSITED ON RESPECTIVE OPPOSONG FIRST AND SECOND SURFACES OF A TRANSPARENT SUBSTRATE</title><author>MILNE, DAVID CHARLES</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2016020641A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2016</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MILNE, DAVID CHARLES</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MILNE, DAVID CHARLES</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF LASER SCRIBING FIRST AND SECOND TRANSPARENT ELECTRICALLY CONDUCTIVE LAYERS DEPOSITED ON RESPECTIVE OPPOSONG FIRST AND SECOND SURFACES OF A TRANSPARENT SUBSTRATE</title><date>2016-02-11</date><risdate>2016</risdate><abstract>The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14') deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising : directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14') and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21') through one or more lenses (22') to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21') passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21') and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21') to scribe a second pattern in the second electrically conductive layer (14').
La présente invention concerne un procédé de gravure au laser de première et seconde couches transparentes électriquement conductrices (14, 14') déposées sur des première et seconde surfaces opposées respectives (12, 13) d'un substrat transparent (11), le procédé comprenant : l'orientation d'un premier faisceau laser (21) à travers une ou plusieurs lentilles (22) vers un point focal sur ou à proximité immédiate de la première surface (12) du substrat (11), de telle sorte que le faisceau laser de focalisation (21) passe à travers la seconde couche électriquement conductrice (14') et la seconde surface (13) du substrat (11) ; l'amorçage d'un mouvement relatif entre le premier faisceau laser (21) et le substrat (11) dans deux axes dans un plan orthogonal à l'axe du premier faisceau laser (21) pour graver un premier motif dans la première couche électriquement conductrice (14) ; l'orientation d'un second faisceau laser (21') à travers une ou plusieurs lentilles (22') vers un point focal sur ou à proximité immédiate de la seconde surface (13) du substrat (11), de telle sorte que le faisceau laser de focalisation (21') passe à travers la première couche électriquement conductrice (14) et la première surface (12) du substrat (11), l'amorçage d'un mouvement relatif entre le second faisceau laser (21') et le substrat (11) dans deux axes dans un plan orthogonal à l'axe du second faisceau laser (21') pour graver un second réseau dans la seconde couche électriquement conductrice (14').</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2016020641A1 |
| source | esp@cenet |
| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD OF LASER SCRIBING FIRST AND SECOND TRANSPARENT ELECTRICALLY CONDUCTIVE LAYERS DEPOSITED ON RESPECTIVE OPPOSONG FIRST AND SECOND SURFACES OF A TRANSPARENT SUBSTRATE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T15%3A06%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MILNE,%20DAVID%20CHARLES&rft.date=2016-02-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2016020641A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |