THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR
A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate. Un...
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| creator | CAI, DENGKE MAYER, MARK, J SMITH, GABRIEL, MICHAEL JACOB, CHERIAN WARD, BENJAMIN, JAMES LOU, XIAOMEI SAHA, KOUSHIK |
| description | A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate.
Un boîtier de diode électroluminescente (DEL) selon divers modes de réalisation peut comprendre un substrat métallique ayant une rugosité de surface. Un réflecteur revêtu d'une couche mince est appliqué sur le substrat métallique. Au moins une puce de diode électroluminescente (DEL) est montée au-dessus d'au moins une partie du substrat métallique. |
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Un boîtier de diode électroluminescente (DEL) selon divers modes de réalisation peut comprendre un substrat métallique ayant une rugosité de surface. Un réflecteur revêtu d'une couche mince est appliqué sur le substrat métallique. Au moins une puce de diode électroluminescente (DEL) est montée au-dessus d'au moins une partie du substrat métallique.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR |
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