TARGET ARRANGEMENT, PROCESSING APPARATUS THEREWITH AND MANUFACTURING METHOD THEREOF
A target arrangement (100; 101; 102; 103; 104; 106) for a processing apparatus (105; 107) is described. The target arrangement includes a target support (110) configured for supporting a non-planar target material (120), wherein the target support (110) includes a vacuum side (130) and an atmospheri...
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| creator | SCHNAPPENBERGER, FRANK |
| description | A target arrangement (100; 101; 102; 103; 104; 106) for a processing apparatus (105; 107) is described. The target arrangement includes a target support (110) configured for supporting a non-planar target material (120), wherein the target support (110) includes a vacuum side (130) and an atmospheric side (140). Further, a processing apparatus adapted for a target arrangement and a method for manufacturing a target arrangement are described.
L'invention concerne un agencement de cible (100 ; 101 ; 102 ; 103 ; 104 ; 106) pour un appareil de traitement (105 ; 107). L'agencement de cible comprend un support de cible (110) configuré de sorte à supporter un matériau de cible non plan (120), le support de cible (110) comprenant un côté sous vide (130) et un côté atmosphérique (140). En outre, l'invention concerne un appareil de traitement conçu pour un agencement de cible et un procédé permettant de fabriquer un agencement de cible. |
| format | Patent |
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L'invention concerne un agencement de cible (100 ; 101 ; 102 ; 103 ; 104 ; 106) pour un appareil de traitement (105 ; 107). L'agencement de cible comprend un support de cible (110) configuré de sorte à supporter un matériau de cible non plan (120), le support de cible (110) comprenant un côté sous vide (130) et un côté atmosphérique (140). En outre, l'invention concerne un appareil de traitement conçu pour un agencement de cible et un procédé permettant de fabriquer un agencement de cible.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160128&DB=EPODOC&CC=WO&NR=2016012038A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160128&DB=EPODOC&CC=WO&NR=2016012038A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHNAPPENBERGER, FRANK</creatorcontrib><title>TARGET ARRANGEMENT, PROCESSING APPARATUS THEREWITH AND MANUFACTURING METHOD THEREOF</title><description>A target arrangement (100; 101; 102; 103; 104; 106) for a processing apparatus (105; 107) is described. The target arrangement includes a target support (110) configured for supporting a non-planar target material (120), wherein the target support (110) includes a vacuum side (130) and an atmospheric side (140). Further, a processing apparatus adapted for a target arrangement and a method for manufacturing a target arrangement are described.
L'invention concerne un agencement de cible (100 ; 101 ; 102 ; 103 ; 104 ; 106) pour un appareil de traitement (105 ; 107). L'agencement de cible comprend un support de cible (110) configuré de sorte à supporter un matériau de cible non plan (120), le support de cible (110) comprenant un côté sous vide (130) et un côté atmosphérique (140). En outre, l'invention concerne un appareil de traitement conçu pour un agencement de cible et un procédé permettant de fabriquer un agencement de cible.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-Q8BVIW1Buh7pJemQpFwudCxF4iRaqP-PiH6A01veViQGssgSiCBY9Bj4JAeKGlPqg5UwDEDAOUl2SDj27CSETnoI2YDmTJ_lkV3sviWavdjc5vtaDj934miQtTuX5TmVdZmv5VFe0xhrVV1UVaumhar5b70B788xFg</recordid><startdate>20160128</startdate><enddate>20160128</enddate><creator>SCHNAPPENBERGER, FRANK</creator><scope>EVB</scope></search><sort><creationdate>20160128</creationdate><title>TARGET ARRANGEMENT, PROCESSING APPARATUS THEREWITH AND MANUFACTURING METHOD THEREOF</title><author>SCHNAPPENBERGER, FRANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2016012038A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHNAPPENBERGER, FRANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHNAPPENBERGER, FRANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TARGET ARRANGEMENT, PROCESSING APPARATUS THEREWITH AND MANUFACTURING METHOD THEREOF</title><date>2016-01-28</date><risdate>2016</risdate><abstract>A target arrangement (100; 101; 102; 103; 104; 106) for a processing apparatus (105; 107) is described. The target arrangement includes a target support (110) configured for supporting a non-planar target material (120), wherein the target support (110) includes a vacuum side (130) and an atmospheric side (140). Further, a processing apparatus adapted for a target arrangement and a method for manufacturing a target arrangement are described.
L'invention concerne un agencement de cible (100 ; 101 ; 102 ; 103 ; 104 ; 106) pour un appareil de traitement (105 ; 107). L'agencement de cible comprend un support de cible (110) configuré de sorte à supporter un matériau de cible non plan (120), le support de cible (110) comprenant un côté sous vide (130) et un côté atmosphérique (140). En outre, l'invention concerne un appareil de traitement conçu pour un agencement de cible et un procédé permettant de fabriquer un agencement de cible.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | TARGET ARRANGEMENT, PROCESSING APPARATUS THEREWITH AND MANUFACTURING METHOD THEREOF |
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