LASER MACHINING METHOD AND LASER MACHINING DEVICE

Proposed is a laser machining method, in which laser machining is continued in an uninterrupted manner and with high accuracy while a workpiece is continuously moved at a fixed speed. Also proposed is a laser machining device. The laser machining method comprises a step in which, while a workpiece W...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OTSUKA AKIRA, KURIHARA HIDEKAZU
Format: Patent
Sprache:eng ; fre ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!