THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS
This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the p...
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| creator | VOULTOS, JOHN D DORFMAN, JAY ROBERT |
| description | This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
La présente invention concerne une composition conductrice transparente de film épais polymère à réponse haptique, qui peut être utilisée dans des applications où le thermoformage du substrat de base permet de former, par exemple, des commutateurs capacitifs. Des substrats de polycarbonate sont souvent utilisés en tant que substrat et la composition conductrice de film épais polymère peut être utilisée sans une quelconque couche barrière. En fonction de sa conception spécifique, le conducteur transparent thermoformable peut être situé au-dessous ou au-dessus d'un conducteur thermoformable en argent. Des circuits électriques thermoformables bénéficient de la présence d'une couche de matière encapsulante située sur la composition conductrice de film épais polymère séchée. Le circuit électrique est ensuite soumis à un procédé de moulage par injection. |
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La présente invention concerne une composition conductrice transparente de film épais polymère à réponse haptique, qui peut être utilisée dans des applications où le thermoformage du substrat de base permet de former, par exemple, des commutateurs capacitifs. Des substrats de polycarbonate sont souvent utilisés en tant que substrat et la composition conductrice de film épais polymère peut être utilisée sans une quelconque couche barrière. En fonction de sa conception spécifique, le conducteur transparent thermoformable peut être situé au-dessous ou au-dessus d'un conducteur thermoformable en argent. Des circuits électriques thermoformables bénéficient de la présence d'une couche de matière encapsulante située sur la composition conductrice de film épais polymère séchée. Le circuit électrique est ensuite soumis à un procédé de moulage par injection.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; PULSE TECHNIQUE ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151001&DB=EPODOC&CC=WO&NR=2015148264A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151001&DB=EPODOC&CC=WO&NR=2015148264A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VOULTOS, JOHN D</creatorcontrib><creatorcontrib>DORFMAN, JAY ROBERT</creatorcontrib><title>THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS</title><description>This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
La présente invention concerne une composition conductrice transparente de film épais polymère à réponse haptique, qui peut être utilisée dans des applications où le thermoformage du substrat de base permet de former, par exemple, des commutateurs capacitifs. Des substrats de polycarbonate sont souvent utilisés en tant que substrat et la composition conductrice de film épais polymère peut être utilisée sans une quelconque couche barrière. En fonction de sa conception spécifique, le conducteur transparent thermoformable peut être situé au-dessous ou au-dessus d'un conducteur thermoformable en argent. Des circuits électriques thermoformables bénéficient de la présence d'une couche de matière encapsulante située sur la composition conductrice de film épais polymère séchée. Le circuit électrique est ensuite soumis à un procédé de moulage par injection.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>PULSE TECHNIQUE</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAUQOEuDqK-wwVnwdYqrvE2JRebH5Jbi1MpEifRQsXnN4MP4HTO8M2zDyvpta2t1-LUSHC2uWrpgRXhGWpqNLAXJjjhpWFAa6oW2XroiBUo4ZgQvAzOmiBBmAqIA7TpyQAKJ5CYLhJC8qgAyWObxDKb3YfHFFe_LrJ1LRPYxPHVx2kcbvEZ331ni22-z8tjcShFvvtPfQFWdDrI</recordid><startdate>20151001</startdate><enddate>20151001</enddate><creator>VOULTOS, JOHN D</creator><creator>DORFMAN, JAY ROBERT</creator><scope>EVB</scope></search><sort><creationdate>20151001</creationdate><title>THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS</title><author>VOULTOS, JOHN D ; DORFMAN, JAY ROBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2015148264A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>PULSE TECHNIQUE</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>VOULTOS, JOHN D</creatorcontrib><creatorcontrib>DORFMAN, JAY ROBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VOULTOS, JOHN D</au><au>DORFMAN, JAY ROBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS</title><date>2015-10-01</date><risdate>2015</risdate><abstract>This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
La présente invention concerne une composition conductrice transparente de film épais polymère à réponse haptique, qui peut être utilisée dans des applications où le thermoformage du substrat de base permet de former, par exemple, des commutateurs capacitifs. Des substrats de polycarbonate sont souvent utilisés en tant que substrat et la composition conductrice de film épais polymère peut être utilisée sans une quelconque couche barrière. En fonction de sa conception spécifique, le conducteur transparent thermoformable peut être situé au-dessous ou au-dessus d'un conducteur thermoformable en argent. Des circuits électriques thermoformables bénéficient de la présence d'une couche de matière encapsulante située sur la composition conductrice de film épais polymère séchée. Le circuit électrique est ensuite soumis à un procédé de moulage par injection.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS PULSE TECHNIQUE SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS |
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