A LIQUID COOLED DEVICE ENCLOSURE
The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method. La présente invention concerne principalement une enceinte (1) de dispositif refroidi par un l...
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| creator | AYYILMAZ, TOLGA KAYNAKOZ, MUHARREM ALAKOC, UGUR |
| description | The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method.
La présente invention concerne principalement une enceinte (1) de dispositif refroidi par un liquide qui est conçue pour refroidir des modules électroniques ayant une forte dissipation thermique, au moyen d'un procédé de refroidissement par un liquide avec des microcanaux. |
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La présente invention concerne principalement une enceinte (1) de dispositif refroidi par un liquide qui est conçue pour refroidir des modules électroniques ayant une forte dissipation thermique, au moyen d'un procédé de refroidissement par un liquide avec des microcanaux.</description><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150709&DB=EPODOC&CC=WO&NR=2015102546A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150709&DB=EPODOC&CC=WO&NR=2015102546A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AYYILMAZ, TOLGA</creatorcontrib><creatorcontrib>KAYNAKOZ, MUHARREM</creatorcontrib><creatorcontrib>ALAKOC, UGUR</creatorcontrib><title>A LIQUID COOLED DEVICE ENCLOSURE</title><description>The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method.
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | A LIQUID COOLED DEVICE ENCLOSURE |
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