PRINTED CHEMICAL MECHANICAL POLISHING PAD HAVING CONTROLLED POROSITY

A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NARENDMATH, KADTHALA RAMAYA, MURUGESH, LAXMAN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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