METHOD FOR FORMING AN ELECTROSTATIC CHUCK USING FILM PRINTING TECHNOLOGY

In one embodiment, a method for forming an electrostatic chuck includes forming vias in a ceramic plate and printing a metal paste in the vias and curing the ceramic plate. The method includes printing the metal paste on a front surface of the ceramic plate and curing the ceramic plate, and printing...

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1. Verfasser: BROWN, KARL M
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description In one embodiment, a method for forming an electrostatic chuck includes forming vias in a ceramic plate and printing a metal paste in the vias and curing the ceramic plate. The method includes printing the metal paste on a front surface of the ceramic plate and curing the ceramic plate, and printing the metal paste on a bottom surface of the ceramic plate and curing the ceramic plate to form one or more contact pads. The method also includes printing a dielectric film on the front surface of the ceramic plate and curing the ceramic plate. The method may further include printing one or more heating elements on a bottom surface of the ceramic plate and curing the ceramic plate, printing the dielectric film on the bottom, and bonding the ceramic plate to a backing plate. La présente invention concerne, selon un mode de réalisation, un procédé de formation d'un mandrin électrostatique qui comprend la formation de trous d'interconnexion dans une plaque en céramique et l'impression d'une pâte métallique dans les trous d'interconnexion et la cuisson de la plaque en céramique. Le procédé comprend l'impression de la pâte métallique sur une surface avant de la plaque en céramique et la cuisson de la plaque en céramique et l'impression de la pâte métallique sur une surface inférieure de la plaque en céramique et la cuisson de la plaque en céramique pour former un ou plusieurs plots de contact. Le procédé comprend également l'impression d'un film diélectrique sur la surface avant de la plaque en céramique et la cuisson de la plaque en céramique. Le procédé peut comprendre en outre l'impression d'un ou plusieurs éléments chauffants sur une surface inférieure de la plaque en céramique et la cuisson de la plaque en céramique, l'impression du film diélectrique sur le dessous et la liaison de la plaque en céramique sur une plaque support.
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The method includes printing the metal paste on a front surface of the ceramic plate and curing the ceramic plate, and printing the metal paste on a bottom surface of the ceramic plate and curing the ceramic plate to form one or more contact pads. The method also includes printing a dielectric film on the front surface of the ceramic plate and curing the ceramic plate. The method may further include printing one or more heating elements on a bottom surface of the ceramic plate and curing the ceramic plate, printing the dielectric film on the bottom, and bonding the ceramic plate to a backing plate. La présente invention concerne, selon un mode de réalisation, un procédé de formation d'un mandrin électrostatique qui comprend la formation de trous d'interconnexion dans une plaque en céramique et l'impression d'une pâte métallique dans les trous d'interconnexion et la cuisson de la plaque en céramique. 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The method includes printing the metal paste on a front surface of the ceramic plate and curing the ceramic plate, and printing the metal paste on a bottom surface of the ceramic plate and curing the ceramic plate to form one or more contact pads. The method also includes printing a dielectric film on the front surface of the ceramic plate and curing the ceramic plate. The method may further include printing one or more heating elements on a bottom surface of the ceramic plate and curing the ceramic plate, printing the dielectric film on the bottom, and bonding the ceramic plate to a backing plate. La présente invention concerne, selon un mode de réalisation, un procédé de formation d'un mandrin électrostatique qui comprend la formation de trous d'interconnexion dans une plaque en céramique et l'impression d'une pâte métallique dans les trous d'interconnexion et la cuisson de la plaque en céramique. Le procédé comprend l'impression de la pâte métallique sur une surface avant de la plaque en céramique et la cuisson de la plaque en céramique et l'impression de la pâte métallique sur une surface inférieure de la plaque en céramique et la cuisson de la plaque en céramique pour former un ou plusieurs plots de contact. Le procédé comprend également l'impression d'un film diélectrique sur la surface avant de la plaque en céramique et la cuisson de la plaque en céramique. Le procédé peut comprendre en outre l'impression d'un ou plusieurs éléments chauffants sur une surface inférieure de la plaque en céramique et la cuisson de la plaque en céramique, l'impression du film diélectrique sur le dessous et la liaison de la plaque en céramique sur une plaque support.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MACHINE TOOLS
MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
title METHOD FOR FORMING AN ELECTROSTATIC CHUCK USING FILM PRINTING TECHNOLOGY
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