COPPER-ALLOY BARRIER LAYERS AND CAPPING LAYERS FOR METALLIZATION IN ELECTRONIC DEVICES

In various embodiments, electronic devices such as thin-film transistors and/or touch-panel displays incorporate electrodes and/or interconnects featuring a conductor layer and, disposed above or below the conductor layer, a capping layer and/or a barrier layer comprising an alloy of Cu and one or m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FRANCOISARLES, DARY, HOGAN, PATRICK, ZHANG, QI, ABOUAF, MARC, SUN, SHUWEI
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!