METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE COMPRISING A THIN SEMICONDUCTOR WAFER

The present invention is concerned with the field of power electronics, such as a method for producing a semiconductor device comprising a thin semiconductor wafer 1 as a device element. The invention describes a method for manufacturing a semiconductor device comprising a thin semiconductor wafer 1...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	JANISCH, WOLFGANG
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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