ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic device and a method for manufacturing an outer housing of the electronic device are provided. The electronic device includes an outer housing including a portion including a base including a non-conductive material and a plurality of islands formed on or above the base, wherein the plu...
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| creator | KIM, HAK-JU CHOI, JONGUL MOON, HEEUL HWANG, CHANG-YOUN |
| description | An electronic device and a method for manufacturing an outer housing of the electronic device are provided. The electronic device includes an outer housing including a portion including a base including a non-conductive material and a plurality of islands formed on or above the base, wherein the plurality of islands include metallic materials, wherein the plurality of islands are spaced apart from each other, and wherein the plurality of islands form a two-dimensional (2D) pattern. The method includes injection-molding a base and forming a plurality of islands on or above the base, wherein the plurality of islands include metallic materials, and wherein the plurality of islands are spaced apart from each other to form a 2D pattern.
L'invention concerne un dispositif électronique et un procédé de fabrication d'un logement externe du dispositif électronique. Le dispositif électronique inclut un logement externe incluant une portion incluant une base incluant un matériau non conducteur et une pluralité d'îlots formés sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, la pluralité d'îlots étant espacés les uns des autres, et la pluralité d'îlots formant un motif à deux dimensions (2D). Le procédé inclut le moulage par injection d'une base et la formation d'une pluralité d'îlots sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, et la pluralité d'îlots étant espacés les uns des autres pour former un motif 2D. |
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L'invention concerne un dispositif électronique et un procédé de fabrication d'un logement externe du dispositif électronique. Le dispositif électronique inclut un logement externe incluant une portion incluant une base incluant un matériau non conducteur et une pluralité d'îlots formés sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, la pluralité d'îlots étant espacés les uns des autres, et la pluralité d'îlots formant un motif à deux dimensions (2D). Le procédé inclut le moulage par injection d'une base et la formation d'une pluralité d'îlots sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, et la pluralité d'îlots étant espacés les uns des autres pour former un motif 2D.</description><language>eng ; fre</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=WO&NR=2014142489A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=WO&NR=2014142489A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, HAK-JU</creatorcontrib><creatorcontrib>CHOI, JONGUL</creatorcontrib><creatorcontrib>MOON, HEEUL</creatorcontrib><creatorcontrib>HWANG, CHANG-YOUN</creatorcontrib><title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME</title><description>An electronic device and a method for manufacturing an outer housing of the electronic device are provided. The electronic device includes an outer housing including a portion including a base including a non-conductive material and a plurality of islands formed on or above the base, wherein the plurality of islands include metallic materials, wherein the plurality of islands are spaced apart from each other, and wherein the plurality of islands form a two-dimensional (2D) pattern. The method includes injection-molding a base and forming a plurality of islands on or above the base, wherein the plurality of islands include metallic materials, and wherein the plurality of islands are spaced apart from each other to form a 2D pattern.
L'invention concerne un dispositif électronique et un procédé de fabrication d'un logement externe du dispositif électronique. Le dispositif électronique inclut un logement externe incluant une portion incluant une base incluant un matériau non conducteur et une pluralité d'îlots formés sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, la pluralité d'îlots étant espacés les uns des autres, et la pluralité d'îlots formant un motif à deux dimensions (2D). Le procédé inclut le moulage par injection d'une base et la formation d'une pluralité d'îlots sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, et la pluralité d'îlots étant espacés les uns des autres pour former un motif 2D.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB39XF1Dgny9_N0VnBxDfN0dlVw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkN8vRzVwjxcFUIdvR15WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgaGJoYmRiYWlo6GxsSpAgC_MSji</recordid><startdate>20140918</startdate><enddate>20140918</enddate><creator>KIM, HAK-JU</creator><creator>CHOI, JONGUL</creator><creator>MOON, HEEUL</creator><creator>HWANG, CHANG-YOUN</creator><scope>EVB</scope></search><sort><creationdate>20140918</creationdate><title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME</title><author>KIM, HAK-JU ; CHOI, JONGUL ; MOON, HEEUL ; HWANG, CHANG-YOUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2014142489A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2014</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, HAK-JU</creatorcontrib><creatorcontrib>CHOI, JONGUL</creatorcontrib><creatorcontrib>MOON, HEEUL</creatorcontrib><creatorcontrib>HWANG, CHANG-YOUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, HAK-JU</au><au>CHOI, JONGUL</au><au>MOON, HEEUL</au><au>HWANG, CHANG-YOUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME</title><date>2014-09-18</date><risdate>2014</risdate><abstract>An electronic device and a method for manufacturing an outer housing of the electronic device are provided. The electronic device includes an outer housing including a portion including a base including a non-conductive material and a plurality of islands formed on or above the base, wherein the plurality of islands include metallic materials, wherein the plurality of islands are spaced apart from each other, and wherein the plurality of islands form a two-dimensional (2D) pattern. The method includes injection-molding a base and forming a plurality of islands on or above the base, wherein the plurality of islands include metallic materials, and wherein the plurality of islands are spaced apart from each other to form a 2D pattern.
L'invention concerne un dispositif électronique et un procédé de fabrication d'un logement externe du dispositif électronique. Le dispositif électronique inclut un logement externe incluant une portion incluant une base incluant un matériau non conducteur et une pluralité d'îlots formés sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, la pluralité d'îlots étant espacés les uns des autres, et la pluralité d'îlots formant un motif à deux dimensions (2D). Le procédé inclut le moulage par injection d'une base et la formation d'une pluralité d'îlots sur ou au-dessus de la base, la pluralité d'îlots incluant des matériaux métalliques, et la pluralité d'îlots étant espacés les uns des autres pour former un motif 2D.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
| title | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME |
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