DISTRIBUTION OF GAS OVER A SEMICONDUCTOR WAFER IN BATCH PROCESSING
A method and apparatus to evenly distribute gas over a wafer in batch processing. Several techniques are disclosed, such as, but not limited to, angling an injector to distribute gas towards a proximate edge of the wafer, and/or reducing the amount of overlap in the center of the wafer of gas from s...
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| creator | SUGINO, RINJI |
| description | A method and apparatus to evenly distribute gas over a wafer in batch processing. Several techniques are disclosed, such as, but not limited to, angling an injector to distribute gas towards a proximate edge of the wafer, and/or reducing the amount of overlap in the center of the wafer of gas from subsequent gas injections.
L'invention concerne un procédé et un appareil permettant de répartir uniformément un gaz au-dessus d'une plaquette lors d'un traitement par lots. Plusieurs techniques sont décrites, telles que, mais non exclusivement, l'inclinaison d'un injecteur pour distribuer le gaz en direction d'un bord proximal de la plaquette, et/ou la réduction de l'importance du chevauchement au centre de la plaquette de gaz provenant d'injections de gaz ultérieures. |
| format | Patent |
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L'invention concerne un procédé et un appareil permettant de répartir uniformément un gaz au-dessus d'une plaquette lors d'un traitement par lots. Plusieurs techniques sont décrites, telles que, mais non exclusivement, l'inclinaison d'un injecteur pour distribuer le gaz en direction d'un bord proximal de la plaquette, et/ou la réduction de l'importance du chevauchement au centre de la plaquette de gaz provenant d'injections de gaz ultérieures.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140522&DB=EPODOC&CC=WO&NR=2014078508A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140522&DB=EPODOC&CC=WO&NR=2014078508A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGINO, RINJI</creatorcontrib><title>DISTRIBUTION OF GAS OVER A SEMICONDUCTOR WAFER IN BATCH PROCESSING</title><description>A method and apparatus to evenly distribute gas over a wafer in batch processing. Several techniques are disclosed, such as, but not limited to, angling an injector to distribute gas towards a proximate edge of the wafer, and/or reducing the amount of overlap in the center of the wafer of gas from subsequent gas injections.
L'invention concerne un procédé et un appareil permettant de répartir uniformément un gaz au-dessus d'une plaquette lors d'un traitement par lots. Plusieurs techniques sont décrites, telles que, mais non exclusivement, l'inclinaison d'un injecteur pour distribuer le gaz en direction d'un bord proximal de la plaquette, et/ou la réduction de l'importance du chevauchement au centre de la plaquette de gaz provenant d'injections de gaz ultérieures.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBy8QwOCfJ0Cg3x9PdT8HdTcHcMVvAPcw1ScFQIdvX1dPb3cwl1DvEPUgh3dAOKevopODmGOHsoBAT5O7sGB3v6ufMwsKYl5hSn8kJpbgZlN1egEt3Ugvz41OKCxOTUvNSS-HB_IwNDEwNzC1MDC0dDY-JUAQCnuCwW</recordid><startdate>20140522</startdate><enddate>20140522</enddate><creator>SUGINO, RINJI</creator><scope>EVB</scope></search><sort><creationdate>20140522</creationdate><title>DISTRIBUTION OF GAS OVER A SEMICONDUCTOR WAFER IN BATCH PROCESSING</title><author>SUGINO, RINJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2014078508A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGINO, RINJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGINO, RINJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DISTRIBUTION OF GAS OVER A SEMICONDUCTOR WAFER IN BATCH PROCESSING</title><date>2014-05-22</date><risdate>2014</risdate><abstract>A method and apparatus to evenly distribute gas over a wafer in batch processing. Several techniques are disclosed, such as, but not limited to, angling an injector to distribute gas towards a proximate edge of the wafer, and/or reducing the amount of overlap in the center of the wafer of gas from subsequent gas injections.
L'invention concerne un procédé et un appareil permettant de répartir uniformément un gaz au-dessus d'une plaquette lors d'un traitement par lots. Plusieurs techniques sont décrites, telles que, mais non exclusivement, l'inclinaison d'un injecteur pour distribuer le gaz en direction d'un bord proximal de la plaquette, et/ou la réduction de l'importance du chevauchement au centre de la plaquette de gaz provenant d'injections de gaz ultérieures.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DISTRIBUTION OF GAS OVER A SEMICONDUCTOR WAFER IN BATCH PROCESSING |
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