COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD

In the present invention, during a time when substrate manufacturing operations are performed, the number (gamma) of components (4) to be sucked is counted, said number being the number of the components to be sucked by means of a mounting head (15), and the allowable number (eta) of the components...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NOUDOMI, RYOU, HATTORI, YOSHIYUKI, TANAKA, TOMIO
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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