INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
The invention relates to an interconnection substrate for electronic components and a method for manufacturing the same. The interconnection substrate comprises rows and columns of connecting units (300). These connecting units (300) are electrically connected with an array of first (16), second (17...
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| creator | LECHLEITER, FRANCOIS |
| description | The invention relates to an interconnection substrate for electronic components and a method for manufacturing the same. The interconnection substrate comprises rows and columns of connecting units (300). These connecting units (300) are electrically connected with an array of first (16), second (17) and third (18) connection traces designed so as to allow, without changing the electrical pattern of the interconnection substrate, a subsequent manufacturing of sets of connecting units (300) with various numbers of connecting units (300).
Cette invention concerne un substrat d'interconnexion pour composants électroniques et son procédé de fabrication. Ledit substrat d'interconnexion comprend des rangées et des colonnes d'unités de connexion (300). Lesdites unités de connexion (300) sont en contact électrique avec un réseau de premières (16), deuxièmes (17) et troisièmes (18) pistes conductrices conçues de façon à permettre la fabrication consécutive d'ensembles d'unités de connexion (300) comprenant divers nombres d'unités de connexion (300) sans modifier le schéma électrique du substrat d'interconnexion. |
| format | Patent |
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Cette invention concerne un substrat d'interconnexion pour composants électroniques et son procédé de fabrication. Ledit substrat d'interconnexion comprend des rangées et des colonnes d'unités de connexion (300). Lesdites unités de connexion (300) sont en contact électrique avec un réseau de premières (16), deuxièmes (17) et troisièmes (18) pistes conductrices conçues de façon à permettre la fabrication consécutive d'ensembles d'unités de connexion (300) comprenant divers nombres d'unités de connexion (300) sans modifier le schéma électrique du substrat d'interconnexion.</description><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131128&DB=EPODOC&CC=WO&NR=2013175261A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131128&DB=EPODOC&CC=WO&NR=2013175261A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LECHLEITER, FRANCOIS</creatorcontrib><title>INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME</title><description>The invention relates to an interconnection substrate for electronic components and a method for manufacturing the same. The interconnection substrate comprises rows and columns of connecting units (300). These connecting units (300) are electrically connected with an array of first (16), second (17) and third (18) connection traces designed so as to allow, without changing the electrical pattern of the interconnection substrate, a subsequent manufacturing of sets of connecting units (300) with various numbers of connecting units (300).
Cette invention concerne un substrat d'interconnexion pour composants électroniques et son procédé de fabrication. Ledit substrat d'interconnexion comprend des rangées et des colonnes d'unités de connexion (300). Lesdites unités de connexion (300) sont en contact électrique avec un réseau de premières (16), deuxièmes (17) et troisièmes (18) pistes conductrices conçues de façon à permettre la fabrication consécutive d'ensembles d'unités de connexion (300) comprenant divers nombres d'unités de connexion (300) sans modifier le schéma électrique du substrat d'interconnexion.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDz9AtxDXL29_NzdQ7x9PdTCA51Cg4JcgxxVXD0c1HwdQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1cI8XBVCHb0deVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGhsaG5qZGZoaOhsbEqQIAGPorIA</recordid><startdate>20131128</startdate><enddate>20131128</enddate><creator>LECHLEITER, FRANCOIS</creator><scope>EVB</scope></search><sort><creationdate>20131128</creationdate><title>INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME</title><author>LECHLEITER, FRANCOIS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2013175261A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LECHLEITER, FRANCOIS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LECHLEITER, FRANCOIS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME</title><date>2013-11-28</date><risdate>2013</risdate><abstract>The invention relates to an interconnection substrate for electronic components and a method for manufacturing the same. The interconnection substrate comprises rows and columns of connecting units (300). These connecting units (300) are electrically connected with an array of first (16), second (17) and third (18) connection traces designed so as to allow, without changing the electrical pattern of the interconnection substrate, a subsequent manufacturing of sets of connecting units (300) with various numbers of connecting units (300).
Cette invention concerne un substrat d'interconnexion pour composants électroniques et son procédé de fabrication. Ledit substrat d'interconnexion comprend des rangées et des colonnes d'unités de connexion (300). Lesdites unités de connexion (300) sont en contact électrique avec un réseau de premières (16), deuxièmes (17) et troisièmes (18) pistes conductrices conçues de façon à permettre la fabrication consécutive d'ensembles d'unités de connexion (300) comprenant divers nombres d'unités de connexion (300) sans modifier le schéma électrique du substrat d'interconnexion.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
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