CIRCUIT CONNECTION MATERIAL, CONNECTION STRUCTURE, AND FABRICATION METHOD FOR SAME

Provided is a circuit connection material for connecting a first circuit member that has a first circuit electrode formed on top of the main surface of a first substrate, and a second circuit member that has a second circuit electrode formed on top of the main surface of a second substrate, in a sta...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEMURA KENZOU, NAKAZAWA TAKASHI
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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