METHOD OF BONDING TWO SUBSTRATES AND DEVICE MANUFACTURED THEREBY

The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic,aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) deposit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BLOM, MARKO THEODOOR, VAN 'T OEVER, RONNY, OLDE RIEKERINK, MARINUS BERNARDUS, TIJSSEN, PETER, ROULET, JEANRISTOPHE, TIGELAAR, HENDRIK JAN HILDEBRAND, FEHR, JEAN-NOEL, OONK, JOHANNES, GUPTA, AMITAVA, HANEVELD, JEROEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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