MOUNTING TABLE AND PLASMA PROCESSING APPARATUS
Provided is a mounting table (70) which is capable of preventing deterioration of an adhesive used in adhesive bonding of an electrostatic chuck, and a plasma processing apparatus (10) which comprises the mounting table (70). The mounting table (70) comprises an electrostatic chuck (50), a base (14)...
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| creator | SUGAMATA TAKESHI SASAKI YASUHARU AOTO TADASHI |
| description | Provided is a mounting table (70) which is capable of preventing deterioration of an adhesive used in adhesive bonding of an electrostatic chuck, and a plasma processing apparatus (10) which comprises the mounting table (70). The mounting table (70) comprises an electrostatic chuck (50), a base (14), and a cylindrical sleeve (80). The electrostatic chuck (50) comprises a front surface which is exposed to plasma, and a back surface which faces the front surface, and a first through-hole is formed therein. The base (14) is bonded to the back surface of the electrostatic chuck (50) by means of a first adhesive (71) and communicates with the first through hole, and a second through hole is formed at the base to have a caliber (R2) larger than a caliber (R1) of the first through hole. The sleeve (80) is bonded to the back surface of the electrostatic chuck (50), in communication with the first through hole, by means of a second adhesive (72).
L'invention concerne une table de montage (70) pouvant prévenir la détérioration d'un adhésif utilisé dans la liaison adhésive d'un mandrin électrostatique, et un appareil de traitement plasma (10) qui comprend la table de montage (70). La table de montage (70) comprend un mandrin électrostatique (50), une base (14), et un manchon cylindrique (80). Le mandrin électrostatique (50) comprend une surface avant qui est exposée au plasma, une surface arrière qui fait face à la surface avant, et un premier trou traversant formé dans celui-ci. La base (14) est liée à la surface arrière du mandrin électrostatique (50) au moyen d'un premier adhésif (71) et communique avec le premier trou traversant, et un second trou traversant est formé à la base pour avoir un calibre (R2) plus grand qu'un calibre (R1) du premier trou traversant. Le manchon (80) est lié à la surface arrière du mandrin électrostatique (50), en communication avec le premier trou traversant, au moyen d'un second adhésif (72). |
| format | Patent |
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L'invention concerne une table de montage (70) pouvant prévenir la détérioration d'un adhésif utilisé dans la liaison adhésive d'un mandrin électrostatique, et un appareil de traitement plasma (10) qui comprend la table de montage (70). La table de montage (70) comprend un mandrin électrostatique (50), une base (14), et un manchon cylindrique (80). Le mandrin électrostatique (50) comprend une surface avant qui est exposée au plasma, une surface arrière qui fait face à la surface avant, et un premier trou traversant formé dans celui-ci. La base (14) est liée à la surface arrière du mandrin électrostatique (50) au moyen d'un premier adhésif (71) et communique avec le premier trou traversant, et un second trou traversant est formé à la base pour avoir un calibre (R2) plus grand qu'un calibre (R1) du premier trou traversant. Le manchon (80) est lié à la surface arrière du mandrin électrostatique (50), en communication avec le premier trou traversant, au moyen d'un second adhésif (72).</description><language>eng ; fre ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130627&DB=EPODOC&CC=WO&NR=2013094564A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130627&DB=EPODOC&CC=WO&NR=2013094564A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGAMATA TAKESHI</creatorcontrib><creatorcontrib>SASAKI YASUHARU</creatorcontrib><creatorcontrib>AOTO TADASHI</creatorcontrib><title>MOUNTING TABLE AND PLASMA PROCESSING APPARATUS</title><description>Provided is a mounting table (70) which is capable of preventing deterioration of an adhesive used in adhesive bonding of an electrostatic chuck, and a plasma processing apparatus (10) which comprises the mounting table (70). The mounting table (70) comprises an electrostatic chuck (50), a base (14), and a cylindrical sleeve (80). The electrostatic chuck (50) comprises a front surface which is exposed to plasma, and a back surface which faces the front surface, and a first through-hole is formed therein. The base (14) is bonded to the back surface of the electrostatic chuck (50) by means of a first adhesive (71) and communicates with the first through hole, and a second through hole is formed at the base to have a caliber (R2) larger than a caliber (R1) of the first through hole. The sleeve (80) is bonded to the back surface of the electrostatic chuck (50), in communication with the first through hole, by means of a second adhesive (72).
L'invention concerne une table de montage (70) pouvant prévenir la détérioration d'un adhésif utilisé dans la liaison adhésive d'un mandrin électrostatique, et un appareil de traitement plasma (10) qui comprend la table de montage (70). La table de montage (70) comprend un mandrin électrostatique (50), une base (14), et un manchon cylindrique (80). Le mandrin électrostatique (50) comprend une surface avant qui est exposée au plasma, une surface arrière qui fait face à la surface avant, et un premier trou traversant formé dans celui-ci. La base (14) est liée à la surface arrière du mandrin électrostatique (50) au moyen d'un premier adhésif (71) et communique avec le premier trou traversant, et un second trou traversant est formé à la base pour avoir un calibre (R2) plus grand qu'un calibre (R1) du premier trou traversant. Le manchon (80) est lié à la surface arrière du mandrin électrostatique (50), en communication avec le premier trou traversant, au moyen d'un second adhésif (72).</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDz9Q_1C_H0c1cIcXTycVVw9HNRCPBxDPZ1VAgI8nd2DQ4GyTkGBDgGOYaEBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDQ2MDSxNTMxNHQ2PiVAEAgRcmwQ</recordid><startdate>20130627</startdate><enddate>20130627</enddate><creator>SUGAMATA TAKESHI</creator><creator>SASAKI YASUHARU</creator><creator>AOTO TADASHI</creator><scope>EVB</scope></search><sort><creationdate>20130627</creationdate><title>MOUNTING TABLE AND PLASMA PROCESSING APPARATUS</title><author>SUGAMATA TAKESHI ; SASAKI YASUHARU ; AOTO TADASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2013094564A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2013</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGAMATA TAKESHI</creatorcontrib><creatorcontrib>SASAKI YASUHARU</creatorcontrib><creatorcontrib>AOTO TADASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGAMATA TAKESHI</au><au>SASAKI YASUHARU</au><au>AOTO TADASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOUNTING TABLE AND PLASMA PROCESSING APPARATUS</title><date>2013-06-27</date><risdate>2013</risdate><abstract>Provided is a mounting table (70) which is capable of preventing deterioration of an adhesive used in adhesive bonding of an electrostatic chuck, and a plasma processing apparatus (10) which comprises the mounting table (70). The mounting table (70) comprises an electrostatic chuck (50), a base (14), and a cylindrical sleeve (80). The electrostatic chuck (50) comprises a front surface which is exposed to plasma, and a back surface which faces the front surface, and a first through-hole is formed therein. The base (14) is bonded to the back surface of the electrostatic chuck (50) by means of a first adhesive (71) and communicates with the first through hole, and a second through hole is formed at the base to have a caliber (R2) larger than a caliber (R1) of the first through hole. The sleeve (80) is bonded to the back surface of the electrostatic chuck (50), in communication with the first through hole, by means of a second adhesive (72).
L'invention concerne une table de montage (70) pouvant prévenir la détérioration d'un adhésif utilisé dans la liaison adhésive d'un mandrin électrostatique, et un appareil de traitement plasma (10) qui comprend la table de montage (70). La table de montage (70) comprend un mandrin électrostatique (50), une base (14), et un manchon cylindrique (80). Le mandrin électrostatique (50) comprend une surface avant qui est exposée au plasma, une surface arrière qui fait face à la surface avant, et un premier trou traversant formé dans celui-ci. La base (14) est liée à la surface arrière du mandrin électrostatique (50) au moyen d'un premier adhésif (71) et communique avec le premier trou traversant, et un second trou traversant est formé à la base pour avoir un calibre (R2) plus grand qu'un calibre (R1) du premier trou traversant. Le manchon (80) est lié à la surface arrière du mandrin électrostatique (50), en communication avec le premier trou traversant, au moyen d'un second adhésif (72).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | MOUNTING TABLE AND PLASMA PROCESSING APPARATUS |
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