APPARATUS FOR TREATING A WAFER-SHAPED ARTICLE

An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-sh...

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1. Verfasser: HOHENWARTER, KARL-HEINZ
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description An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber. Appareil pour traiter des articles en forme de tranches, comportant une chambre de traitement fermée, un mandrin de serrage situé à l'intérieur de la chambre de traitement fermée, et au moins un dispositif distributeur de liquide de traitement monté à l'intérieur de la chambre. La chambre de traitement fermée comporte un couvercle qui peut être ouvert pour placer un article en forme de tranche à l'intérieur de ladite chambre. Le couvercle comprend un dispositif chauffant conçu pour chauffer un article en forme de tranche placé dans la chambre de traitement fermée.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title APPARATUS FOR TREATING A WAFER-SHAPED ARTICLE
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