METHOD FOR MANUFACTURING PHOTOCURED PRODUCT
This method has a molding step of molding by sandwiching a photocurable composition layer formed by a photocurable composition for imprinting between a substrate and a mold in which a concave-convex pattern is formed, a photocuring step of exposing the photocurable composition layer to make a photoc...
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| creator | TSUKIDATE, YOSHITAKA NAKAGAWA, MASARU MIYAKE, HIROTO OHSAKI, TAKESHI |
| description | This method has a molding step of molding by sandwiching a photocurable composition layer formed by a photocurable composition for imprinting between a substrate and a mold in which a concave-convex pattern is formed, a photocuring step of exposing the photocurable composition layer to make a photocured product, and a releasing step of releasing the mold from the photocured product, wherein the adhesive force per unit area, with respect to a member having the same outer surface as the mold, of a specimen obtained by exposing and curing the photocurable composition for imprinting is no more than 15 mN/mm2.
L'invention concerne un procédé qui comporte une étape de moulage par prise en sandwich d'une composition photodurcissable, formée par une composition photodurcissable pour impression, entre un substrat et un moule dans lequel un motif concavo-convexe est formé, une étape de photodurcissage consistant à exposer la couche de composition photodurcissable pour fabriquer un produit photodurci, et une étape de démoulage consistant à démouler le produit photodurci du moule, la force d'adhérence par unité de surface, par rapport à un élément ayant la même surface extérieure que le moule, d'un échantillon obtenu par exposition et durcissement de la composition photodurcissable pour impression étant de pas plus 15 mN/mm2. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2012121143A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2012121143A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2012121143A13</originalsourceid><addsrcrecordid>eNrjZND2dQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCPDwD_F3Dg1ydVEICPJ3CXUO4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgaGRkBoaGLsaGhMnCoAIXkl_g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING PHOTOCURED PRODUCT</title><source>esp@cenet</source><creator>TSUKIDATE, YOSHITAKA ; NAKAGAWA, MASARU ; MIYAKE, HIROTO ; OHSAKI, TAKESHI</creator><creatorcontrib>TSUKIDATE, YOSHITAKA ; NAKAGAWA, MASARU ; MIYAKE, HIROTO ; OHSAKI, TAKESHI</creatorcontrib><description>This method has a molding step of molding by sandwiching a photocurable composition layer formed by a photocurable composition for imprinting between a substrate and a mold in which a concave-convex pattern is formed, a photocuring step of exposing the photocurable composition layer to make a photocured product, and a releasing step of releasing the mold from the photocured product, wherein the adhesive force per unit area, with respect to a member having the same outer surface as the mold, of a specimen obtained by exposing and curing the photocurable composition for imprinting is no more than 15 mN/mm2.
L'invention concerne un procédé qui comporte une étape de moulage par prise en sandwich d'une composition photodurcissable, formée par une composition photodurcissable pour impression, entre un substrat et un moule dans lequel un motif concavo-convexe est formé, une étape de photodurcissage consistant à exposer la couche de composition photodurcissable pour fabriquer un produit photodurci, et une étape de démoulage consistant à démouler le produit photodurci du moule, la force d'adhérence par unité de surface, par rapport à un élément ayant la même surface extérieure que le moule, d'un échantillon obtenu par exposition et durcissement de la composition photodurcissable pour impression étant de pas plus 15 mN/mm2.</description><language>eng ; fre ; jpn</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ; MATERIALS THEREFOR ; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES ; METALLURGY ; NANOTECHNOLOGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120913&DB=EPODOC&CC=WO&NR=2012121143A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120913&DB=EPODOC&CC=WO&NR=2012121143A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUKIDATE, YOSHITAKA</creatorcontrib><creatorcontrib>NAKAGAWA, MASARU</creatorcontrib><creatorcontrib>MIYAKE, HIROTO</creatorcontrib><creatorcontrib>OHSAKI, TAKESHI</creatorcontrib><title>METHOD FOR MANUFACTURING PHOTOCURED PRODUCT</title><description>This method has a molding step of molding by sandwiching a photocurable composition layer formed by a photocurable composition for imprinting between a substrate and a mold in which a concave-convex pattern is formed, a photocuring step of exposing the photocurable composition layer to make a photocured product, and a releasing step of releasing the mold from the photocured product, wherein the adhesive force per unit area, with respect to a member having the same outer surface as the mold, of a specimen obtained by exposing and curing the photocurable composition for imprinting is no more than 15 mN/mm2.
L'invention concerne un procédé qui comporte une étape de moulage par prise en sandwich d'une composition photodurcissable, formée par une composition photodurcissable pour impression, entre un substrat et un moule dans lequel un motif concavo-convexe est formé, une étape de photodurcissage consistant à exposer la couche de composition photodurcissable pour fabriquer un produit photodurci, et une étape de démoulage consistant à démouler le produit photodurci du moule, la force d'adhérence par unité de surface, par rapport à un élément ayant la même surface extérieure que le moule, d'un échantillon obtenu par exposition et durcissement de la composition photodurcissable pour impression étant de pas plus 15 mN/mm2.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</subject><subject>METALLURGY</subject><subject>NANOTECHNOLOGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND2dQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCPDwD_F3Dg1ydVEICPJ3CXUO4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgaGRkBoaGLsaGhMnCoAIXkl_g</recordid><startdate>20120913</startdate><enddate>20120913</enddate><creator>TSUKIDATE, YOSHITAKA</creator><creator>NAKAGAWA, MASARU</creator><creator>MIYAKE, HIROTO</creator><creator>OHSAKI, TAKESHI</creator><scope>EVB</scope></search><sort><creationdate>20120913</creationdate><title>METHOD FOR MANUFACTURING PHOTOCURED PRODUCT</title><author>TSUKIDATE, YOSHITAKA ; NAKAGAWA, MASARU ; MIYAKE, HIROTO ; OHSAKI, TAKESHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2012121143A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2012</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</topic><topic>METALLURGY</topic><topic>NANOTECHNOLOGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUKIDATE, YOSHITAKA</creatorcontrib><creatorcontrib>NAKAGAWA, MASARU</creatorcontrib><creatorcontrib>MIYAKE, HIROTO</creatorcontrib><creatorcontrib>OHSAKI, TAKESHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUKIDATE, YOSHITAKA</au><au>NAKAGAWA, MASARU</au><au>MIYAKE, HIROTO</au><au>OHSAKI, TAKESHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING PHOTOCURED PRODUCT</title><date>2012-09-13</date><risdate>2012</risdate><abstract>This method has a molding step of molding by sandwiching a photocurable composition layer formed by a photocurable composition for imprinting between a substrate and a mold in which a concave-convex pattern is formed, a photocuring step of exposing the photocurable composition layer to make a photocured product, and a releasing step of releasing the mold from the photocured product, wherein the adhesive force per unit area, with respect to a member having the same outer surface as the mold, of a specimen obtained by exposing and curing the photocurable composition for imprinting is no more than 15 mN/mm2.
L'invention concerne un procédé qui comporte une étape de moulage par prise en sandwich d'une composition photodurcissable, formée par une composition photodurcissable pour impression, entre un substrat et un moule dans lequel un motif concavo-convexe est formé, une étape de photodurcissage consistant à exposer la couche de composition photodurcissable pour fabriquer un produit photodurci, et une étape de démoulage consistant à démouler le produit photodurci du moule, la force d'adhérence par unité de surface, par rapport à un élément ayant la même surface extérieure que le moule, d'un échantillon obtenu par exposition et durcissement de la composition photodurcissable pour impression étant de pas plus 15 mN/mm2.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; jpn |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY NANOTECHNOLOGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | METHOD FOR MANUFACTURING PHOTOCURED PRODUCT |
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