APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL MECHANICAL POLISHING CONSUMABLES

Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus includes a rotatable platen and a conditioner device coupled to a base. The conditioner device includes a shaft rotatably coupled...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DHANDAPANI, SIVAKUMAR, GARRETSON, CHARLES C, TSAI, STAN, D, MENK, GREGORY, E, JAIN, ASHEESH
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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