SMART PACKAGE

A smart package (200), wherein the smart package comprises a module (100) for measuring acceleration applied to the smart package. The module (100) comprises preferably an acceleration sensor and a memory carrier, as well as a microcontroller for controlling operation of the acceleration sensor and...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	POEYHOENEN, NIILO, JOUPPI, MARTTI, MAIJALA, JUHA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PHYSICS STORING TESTING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A smart package (200), wherein the smart package comprises a module (100) for measuring acceleration applied to the smart package. The module (100) comprises preferably an acceleration sensor and a memory carrier, as well as a microcontroller for controlling operation of the acceleration sensor and for storing information produced thereby in said memory carrier. According to one embodiment, said acceleration sensor, memory carrier, and microcontroller are integrated into structures (201, 202) of said smart package (200). L'invention concerne un boîtier intelligent (200), de boîtier intelligent comprenant un module (100) servant à mesurer l'accélération appliquée au boîtier intelligent. Le module (100) comprend de préférence un capteur d'accélération et un support de mémoire, ainsi qu'une microcommande servant à commander le fonctionnement du capteur d'accélération et à mémoriser les informations ainsi produites dans ledit support de mémoire. Selon un mode de réalisation, lesdits capteur d'accélération, support de mémoire, et microcommande sont intégrés dans des structures (201, 202) dudit boîtier intelligent (200).