THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS
A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sect...
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| creator | NG, KIM CHOON YAP, CHRISTOPHER, R NG, SU HUI, JOSEPH CHAN, MARK, AARON |
| description | A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
L'invention porte sur un thermosiphon, qui comprend une section d'évaporateur, une section de condenseur couplée à la section d'évaporateur, et un guide de condensat chemisant une partie interne de la section d'évaporateur et des surfaces internes de la section de condenseur. Le guide de condensat définit un coeur de vapeur dans les sections d'évaporateur et de condenseur, et est configuré de façon à renvoyer le condensat à la section d'évaporateur quelle que soit une orientation du thermosiphon. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2011159251A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2011159251A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2011159251A13</originalsourceid><addsrcrecordid>eNrjZNAL8XAN8vUPjgzw8PdTcPMPUnD29_fx9HNXcPVxdQ4J8vfzdAYK-Qb4-7n6hQTzMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL4cH8jA0NDQ1NLI1NDR0Nj4lQBAKp4Jws</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS</title><source>esp@cenet</source><creator>NG, KIM CHOON ; YAP, CHRISTOPHER, R ; NG, SU HUI, JOSEPH ; CHAN, MARK, AARON</creator><creatorcontrib>NG, KIM CHOON ; YAP, CHRISTOPHER, R ; NG, SU HUI, JOSEPH ; CHAN, MARK, AARON</creatorcontrib><description>A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
L'invention porte sur un thermosiphon, qui comprend une section d'évaporateur, une section de condenseur couplée à la section d'évaporateur, et un guide de condensat chemisant une partie interne de la section d'évaporateur et des surfaces internes de la section de condenseur. Le guide de condensat définit un coeur de vapeur dans les sections d'évaporateur et de condenseur, et est configuré de façon à renvoyer le condensat à la section d'évaporateur quelle que soit une orientation du thermosiphon.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111222&DB=EPODOC&CC=WO&NR=2011159251A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111222&DB=EPODOC&CC=WO&NR=2011159251A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NG, KIM CHOON</creatorcontrib><creatorcontrib>YAP, CHRISTOPHER, R</creatorcontrib><creatorcontrib>NG, SU HUI, JOSEPH</creatorcontrib><creatorcontrib>CHAN, MARK, AARON</creatorcontrib><title>THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS</title><description>A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
L'invention porte sur un thermosiphon, qui comprend une section d'évaporateur, une section de condenseur couplée à la section d'évaporateur, et un guide de condensat chemisant une partie interne de la section d'évaporateur et des surfaces internes de la section de condenseur. Le guide de condensat définit un coeur de vapeur dans les sections d'évaporateur et de condenseur, et est configuré de façon à renvoyer le condensat à la section d'évaporateur quelle que soit une orientation du thermosiphon.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAL8XAN8vUPjgzw8PdTcPMPUnD29_fx9HNXcPVxdQ4J8vfzdAYK-Qb4-7n6hQTzMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL4cH8jA0NDQ1NLI1NDR0Nj4lQBAKp4Jws</recordid><startdate>20111222</startdate><enddate>20111222</enddate><creator>NG, KIM CHOON</creator><creator>YAP, CHRISTOPHER, R</creator><creator>NG, SU HUI, JOSEPH</creator><creator>CHAN, MARK, AARON</creator><scope>EVB</scope></search><sort><creationdate>20111222</creationdate><title>THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS</title><author>NG, KIM CHOON ; YAP, CHRISTOPHER, R ; NG, SU HUI, JOSEPH ; CHAN, MARK, AARON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2011159251A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>NG, KIM CHOON</creatorcontrib><creatorcontrib>YAP, CHRISTOPHER, R</creatorcontrib><creatorcontrib>NG, SU HUI, JOSEPH</creatorcontrib><creatorcontrib>CHAN, MARK, AARON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NG, KIM CHOON</au><au>YAP, CHRISTOPHER, R</au><au>NG, SU HUI, JOSEPH</au><au>CHAN, MARK, AARON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS</title><date>2011-12-22</date><risdate>2011</risdate><abstract>A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
L'invention porte sur un thermosiphon, qui comprend une section d'évaporateur, une section de condenseur couplée à la section d'évaporateur, et un guide de condensat chemisant une partie interne de la section d'évaporateur et des surfaces internes de la section de condenseur. Le guide de condensat définit un coeur de vapeur dans les sections d'évaporateur et de condenseur, et est configuré de façon à renvoyer le condensat à la section d'évaporateur quelle que soit une orientation du thermosiphon.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS |
| title | THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS |
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