USE OF LASER ENERGY TRANSPARENT STOP LAYER TO ACHIEVE MINIMAL DEBRIS GENERATION IN LASER SCRIBING A MULTILAYER PATTERNED WORKPIECE

A solution to failure mechanisms caused by mechanical sawing of a mechanical semiconductor workpiece (10) entails use of a laser beam to cut and remove the electrically conductive (32) and low-k dielectric (34) material layers from a dicing street (18) before saw dicing to separate semiconductor dev...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HOOPER, ANDY E, ZHANG, HAIBIN, BARSIC, DAVID, VANDERGIESSEN, CLINT R, O'BRIEN, JAMES N
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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