DEVICE AND METHOD FOR GENERATING A PLASMA DISCHARGE FOR PATTERNING THE SURFACE OF A SUBSTRATE
Device for generating a plasma discharge near a substrate for patterning the surface of the substrate, comprising a first electrode having a first discharge portion and a second electrode having a second discharge portion, a high voltage source for generating a high voltage difference between the fi...
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| creator | HUISKAMP, TOM VAN SCHIJNDEL, ANTONIUS HUBERTUS VAN HIJNINGEN, NICOLAAS CORNELIS JOSEPHUS BLOM, PAULUS PETRUS MARIA TE SLIGTE, EDWIN DE HAAN, HUGO ANTON MARIE STEVENS, ALQUIN ALPHONS ELISABETH HUIJBREGTS, LAURENTIA JOHANNA |
| description | Device for generating a plasma discharge near a substrate for patterning the surface of the substrate, comprising a first electrode having a first discharge portion and a second electrode having a second discharge portion, a high voltage source for generating a high voltage difference between the first and the second electrode, and positioning means for positioning the first electrode with respect to the substrate. The device is further provided with an intermediate structure that is, in use, arranged in between the first electrode and the substrate while allowing for positioning the first electrode with respect to the substrate.
L'invention concerne un dispositif pour générer une décharge de plasma à proximité d'un substrat afin de former un motif sur la surface de celui-ci, lequel comprend une première électrode possédant une première partie de décharge et une seconde électrode possédant une seconde partie de décharge, une source de haute tension afin de dégénérer un différentiel haute tension entre les première et seconde électrodes, et un moyen de positionnement afin de positionner la première électrode par rapport au substrat. Le dispositif comprend en outre une structure intermédiaire qui, lors de l'utilisation, est disposée entre la première électrode et le substrat tout en permettant de positionner la première électrode par rapport au substrat. |
| format | Patent |
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L'invention concerne un dispositif pour générer une décharge de plasma à proximité d'un substrat afin de former un motif sur la surface de celui-ci, lequel comprend une première électrode possédant une première partie de décharge et une seconde électrode possédant une seconde partie de décharge, une source de haute tension afin de dégénérer un différentiel haute tension entre les première et seconde électrodes, et un moyen de positionnement afin de positionner la première électrode par rapport au substrat. Le dispositif comprend en outre une structure intermédiaire qui, lors de l'utilisation, est disposée entre la première électrode et le substrat tout en permettant de positionner la première électrode par rapport au substrat.</description><language>eng ; fre</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PLASMA TECHNIQUE ; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS ; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110825&DB=EPODOC&CC=WO&NR=2011102711A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110825&DB=EPODOC&CC=WO&NR=2011102711A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUISKAMP, TOM</creatorcontrib><creatorcontrib>VAN SCHIJNDEL, ANTONIUS HUBERTUS</creatorcontrib><creatorcontrib>VAN HIJNINGEN, NICOLAAS CORNELIS JOSEPHUS</creatorcontrib><creatorcontrib>BLOM, PAULUS PETRUS MARIA</creatorcontrib><creatorcontrib>TE SLIGTE, EDWIN</creatorcontrib><creatorcontrib>DE HAAN, HUGO ANTON MARIE</creatorcontrib><creatorcontrib>STEVENS, ALQUIN ALPHONS ELISABETH</creatorcontrib><creatorcontrib>HUIJBREGTS, LAURENTIA JOHANNA</creatorcontrib><title>DEVICE AND METHOD FOR GENERATING A PLASMA DISCHARGE FOR PATTERNING THE SURFACE OF A SUBSTRATE</title><description>Device for generating a plasma discharge near a substrate for patterning the surface of the substrate, comprising a first electrode having a first discharge portion and a second electrode having a second discharge portion, a high voltage source for generating a high voltage difference between the first and the second electrode, and positioning means for positioning the first electrode with respect to the substrate. The device is further provided with an intermediate structure that is, in use, arranged in between the first electrode and the substrate while allowing for positioning the first electrode with respect to the substrate.
L'invention concerne un dispositif pour générer une décharge de plasma à proximité d'un substrat afin de former un motif sur la surface de celui-ci, lequel comprend une première électrode possédant une première partie de décharge et une seconde électrode possédant une seconde partie de décharge, une source de haute tension afin de dégénérer un différentiel haute tension entre les première et seconde électrodes, et un moyen de positionnement afin de positionner la première électrode par rapport au substrat. Le dispositif comprend en outre une structure intermédiaire qui, lors de l'utilisation, est disposée entre la première électrode et le substrat tout en permettant de positionner la première électrode par rapport au substrat.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PLASMA TECHNIQUE</subject><subject>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</subject><subject>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLEKwjAUheEuDqK-wwVnoamD8zW5aQI2KcltnaQUiZNoob4_RvEBnM7y_WdZXBT1VhKgU9AQG69A-wA1OQrI1tWA0J4wNgjKRmkw1PQVLTJTcB_BhiB2QWP-8ToHsTtGzjmti8VtvM9p89tVsdXE0uzS9BzSPI3X9Eiv4eyrUghRVgchUOz_U29TaDLM</recordid><startdate>20110825</startdate><enddate>20110825</enddate><creator>HUISKAMP, TOM</creator><creator>VAN SCHIJNDEL, ANTONIUS HUBERTUS</creator><creator>VAN HIJNINGEN, NICOLAAS CORNELIS JOSEPHUS</creator><creator>BLOM, PAULUS PETRUS MARIA</creator><creator>TE SLIGTE, EDWIN</creator><creator>DE HAAN, HUGO ANTON MARIE</creator><creator>STEVENS, ALQUIN ALPHONS ELISABETH</creator><creator>HUIJBREGTS, LAURENTIA JOHANNA</creator><scope>EVB</scope></search><sort><creationdate>20110825</creationdate><title>DEVICE AND METHOD FOR GENERATING A PLASMA DISCHARGE FOR PATTERNING THE SURFACE OF A SUBSTRATE</title><author>HUISKAMP, TOM ; VAN SCHIJNDEL, ANTONIUS HUBERTUS ; VAN HIJNINGEN, NICOLAAS CORNELIS JOSEPHUS ; BLOM, PAULUS PETRUS MARIA ; TE SLIGTE, EDWIN ; DE HAAN, HUGO ANTON MARIE ; STEVENS, ALQUIN ALPHONS ELISABETH ; HUIJBREGTS, LAURENTIA JOHANNA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2011102711A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2011</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PLASMA TECHNIQUE</topic><topic>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</topic><topic>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>HUISKAMP, TOM</creatorcontrib><creatorcontrib>VAN SCHIJNDEL, ANTONIUS HUBERTUS</creatorcontrib><creatorcontrib>VAN HIJNINGEN, NICOLAAS CORNELIS JOSEPHUS</creatorcontrib><creatorcontrib>BLOM, PAULUS PETRUS MARIA</creatorcontrib><creatorcontrib>TE SLIGTE, EDWIN</creatorcontrib><creatorcontrib>DE HAAN, HUGO ANTON MARIE</creatorcontrib><creatorcontrib>STEVENS, ALQUIN ALPHONS ELISABETH</creatorcontrib><creatorcontrib>HUIJBREGTS, LAURENTIA JOHANNA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUISKAMP, TOM</au><au>VAN SCHIJNDEL, ANTONIUS HUBERTUS</au><au>VAN HIJNINGEN, NICOLAAS CORNELIS JOSEPHUS</au><au>BLOM, PAULUS PETRUS MARIA</au><au>TE SLIGTE, EDWIN</au><au>DE HAAN, HUGO ANTON MARIE</au><au>STEVENS, ALQUIN ALPHONS ELISABETH</au><au>HUIJBREGTS, LAURENTIA JOHANNA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE AND METHOD FOR GENERATING A PLASMA DISCHARGE FOR PATTERNING THE SURFACE OF A SUBSTRATE</title><date>2011-08-25</date><risdate>2011</risdate><abstract>Device for generating a plasma discharge near a substrate for patterning the surface of the substrate, comprising a first electrode having a first discharge portion and a second electrode having a second discharge portion, a high voltage source for generating a high voltage difference between the first and the second electrode, and positioning means for positioning the first electrode with respect to the substrate. The device is further provided with an intermediate structure that is, in use, arranged in between the first electrode and the substrate while allowing for positioning the first electrode with respect to the substrate.
L'invention concerne un dispositif pour générer une décharge de plasma à proximité d'un substrat afin de former un motif sur la surface de celui-ci, lequel comprend une première électrode possédant une première partie de décharge et une seconde électrode possédant une seconde partie de décharge, une source de haute tension afin de dégénérer un différentiel haute tension entre les première et seconde électrodes, et un moyen de positionnement afin de positionner la première électrode par rapport au substrat. Le dispositif comprend en outre une structure intermédiaire qui, lors de l'utilisation, est disposée entre la première électrode et le substrat tout en permettant de positionner la première électrode par rapport au substrat.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | DEVICE AND METHOD FOR GENERATING A PLASMA DISCHARGE FOR PATTERNING THE SURFACE OF A SUBSTRATE |
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