CIRCUIT BOARD WITH OVAL MICRO VIA
Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer (85) of a circuit board (20). The first interconnect layer (85) includes a first conductor structure (120). A first via (1...
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| creator | MCLELLAN, NEIL LEUNG, ANDREW, KW |
| description | Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer (85) of a circuit board (20). The first interconnect layer (85) includes a first conductor structure (120). A first via (140) is formed in the first interconnect layer (85) and in electrical contact with the first conductor structure (120). The first via (140) has a first oval footprint.
L'invention concerne différentes cartes de circuits et différents procédés de fabrication pour celles-ci. Selon un aspect, il est proposé un procédé de fabrication qui comprend la formation d'une première couche d'interconnexion (85) d'une carte de circuits (20). La première couche d'interconnexion (85) comprend une première structure conductrice (120). Un premier trou d'interconnexion (140) est formé dans la première couche d'interconnexion (85) et en contact électrique avec la première structure conductrice (120). Le premier trou d'interconnexion (140) a un premier encombrement ovale. |
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L'invention concerne différentes cartes de circuits et différents procédés de fabrication pour celles-ci. Selon un aspect, il est proposé un procédé de fabrication qui comprend la formation d'une première couche d'interconnexion (85) d'une carte de circuits (20). La première couche d'interconnexion (85) comprend une première structure conductrice (120). Un premier trou d'interconnexion (140) est formé dans la première couche d'interconnexion (85) et en contact électrique avec la première structure conductrice (120). Le premier trou d'interconnexion (140) a un premier encombrement ovale.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110407&DB=EPODOC&CC=WO&NR=2011041072A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76517</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110407&DB=EPODOC&CC=WO&NR=2011041072A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MCLELLAN, NEIL</creatorcontrib><creatorcontrib>LEUNG, ANDREW, KW</creatorcontrib><title>CIRCUIT BOARD WITH OVAL MICRO VIA</title><description>Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer (85) of a circuit board (20). The first interconnect layer (85) includes a first conductor structure (120). A first via (140) is formed in the first interconnect layer (85) and in electrical contact with the first conductor structure (120). The first via (140) has a first oval footprint.
L'invention concerne différentes cartes de circuits et différents procédés de fabrication pour celles-ci. Selon un aspect, il est proposé un procédé de fabrication qui comprend la formation d'une première couche d'interconnexion (85) d'une carte de circuits (20). La première couche d'interconnexion (85) comprend une première structure conductrice (120). Un premier trou d'interconnexion (140) est formé dans la première couche d'interconnexion (85) et en contact électrique avec la première structure conductrice (120). Le premier trou d'interconnexion (140) a un premier encombrement ovale.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB09gxyDvUMUXDydwxyUQj3DPFQ8A9z9FHw9XQO8lcI83TkYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBoaGBiaGBuZGjobGxKkCAIQGIr8</recordid><startdate>20110407</startdate><enddate>20110407</enddate><creator>MCLELLAN, NEIL</creator><creator>LEUNG, ANDREW, KW</creator><scope>EVB</scope></search><sort><creationdate>20110407</creationdate><title>CIRCUIT BOARD WITH OVAL MICRO VIA</title><author>MCLELLAN, NEIL ; LEUNG, ANDREW, KW</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2011041072A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MCLELLAN, NEIL</creatorcontrib><creatorcontrib>LEUNG, ANDREW, KW</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MCLELLAN, NEIL</au><au>LEUNG, ANDREW, KW</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT BOARD WITH OVAL MICRO VIA</title><date>2011-04-07</date><risdate>2011</risdate><abstract>Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer (85) of a circuit board (20). The first interconnect layer (85) includes a first conductor structure (120). A first via (140) is formed in the first interconnect layer (85) and in electrical contact with the first conductor structure (120). The first via (140) has a first oval footprint.
L'invention concerne différentes cartes de circuits et différents procédés de fabrication pour celles-ci. Selon un aspect, il est proposé un procédé de fabrication qui comprend la formation d'une première couche d'interconnexion (85) d'une carte de circuits (20). La première couche d'interconnexion (85) comprend une première structure conductrice (120). Un premier trou d'interconnexion (140) est formé dans la première couche d'interconnexion (85) et en contact électrique avec la première structure conductrice (120). Le premier trou d'interconnexion (140) a un premier encombrement ovale.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | CIRCUIT BOARD WITH OVAL MICRO VIA |
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