INTERCONNECT AND SYSTEM INCLUDING SAME
An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall. L'invention porte sur une interconnexion. L'interconnexio...
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| creator | JAN, WILLIAM BUENZLI, CHARLES ACQUAVIVA, JOSEPH, R KUAN, NELSON WU, CHIEN, HUNG ZIFF, JOSHUA |
| description | An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
L'invention porte sur une interconnexion. L'interconnexion comprend une structure d'isolation thermique et une couche de matériau conducteur qui couvre la structure d'isolation thermique. La structure d'isolation thermique comprend une première extrémité, une seconde extrémité et une paroi latérale. |
| format | Patent |
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L'invention porte sur une interconnexion. L'interconnexion comprend une structure d'isolation thermique et une couche de matériau conducteur qui couvre la structure d'isolation thermique. La structure d'isolation thermique comprend une première extrémité, une seconde extrémité et une paroi latérale.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; COLORIMETRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT ; MEASURING ; PHYSICS ; RADIATION PYROMETRY ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101014&DB=EPODOC&CC=WO&NR=2010118036A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101014&DB=EPODOC&CC=WO&NR=2010118036A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JAN, WILLIAM</creatorcontrib><creatorcontrib>BUENZLI, CHARLES</creatorcontrib><creatorcontrib>ACQUAVIVA, JOSEPH, R</creatorcontrib><creatorcontrib>KUAN, NELSON</creatorcontrib><creatorcontrib>WU, CHIEN, HUNG</creatorcontrib><creatorcontrib>ZIFF, JOSHUA</creatorcontrib><title>INTERCONNECT AND SYSTEM INCLUDING SAME</title><description>An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
L'invention porte sur une interconnexion. L'interconnexion comprend une structure d'isolation thermique et une couche de matériau conducteur qui couvre la structure d'isolation thermique. La structure d'isolation thermique comprend une première extrémité, une seconde extrémité et une paroi latérale.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COLORIMETRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>RADIATION PYROMETRY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDz9AtxDXL29_NzdQ5RcPRzUQiODA5x9VXw9HP2CXXx9HNXCHb0deVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGhgaGhhYGxmaOhsbEqQIAVpgkcA</recordid><startdate>20101014</startdate><enddate>20101014</enddate><creator>JAN, WILLIAM</creator><creator>BUENZLI, CHARLES</creator><creator>ACQUAVIVA, JOSEPH, R</creator><creator>KUAN, NELSON</creator><creator>WU, CHIEN, HUNG</creator><creator>ZIFF, JOSHUA</creator><scope>EVB</scope></search><sort><creationdate>20101014</creationdate><title>INTERCONNECT AND SYSTEM INCLUDING SAME</title><author>JAN, WILLIAM ; BUENZLI, CHARLES ; ACQUAVIVA, JOSEPH, R ; KUAN, NELSON ; WU, CHIEN, HUNG ; ZIFF, JOSHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2010118036A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COLORIMETRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>RADIATION PYROMETRY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JAN, WILLIAM</creatorcontrib><creatorcontrib>BUENZLI, CHARLES</creatorcontrib><creatorcontrib>ACQUAVIVA, JOSEPH, R</creatorcontrib><creatorcontrib>KUAN, NELSON</creatorcontrib><creatorcontrib>WU, CHIEN, HUNG</creatorcontrib><creatorcontrib>ZIFF, JOSHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JAN, WILLIAM</au><au>BUENZLI, CHARLES</au><au>ACQUAVIVA, JOSEPH, R</au><au>KUAN, NELSON</au><au>WU, CHIEN, HUNG</au><au>ZIFF, JOSHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTERCONNECT AND SYSTEM INCLUDING SAME</title><date>2010-10-14</date><risdate>2010</risdate><abstract>An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
L'invention porte sur une interconnexion. L'interconnexion comprend une structure d'isolation thermique et une couche de matériau conducteur qui couvre la structure d'isolation thermique. La structure d'isolation thermique comprend une première extrémité, une seconde extrémité et une paroi latérale.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING |
| title | INTERCONNECT AND SYSTEM INCLUDING SAME |
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